Electronics Forum | Thu Sep 02 22:23:44 EDT 2004 | davef
Dunno about something formal. After you specify your hole size and fill material, why not say something like: " Surface to be planar prior to final plating and metallization. Boards must be suitable for via in pad technology." We do not allow plati
Electronics Forum | Thu Sep 02 18:39:48 EDT 2004 | steveg
We're having a lot of problems with failed solder joints to gold-plated MOSFET leads. Gold plate thickness spec is 60uin, but we've seen as much as 200uin in cross-section, so we're obviously concerned about gold embrittlement issues. Pre-tinning w
Electronics Forum | Sat Nov 06 07:22:36 EST 2004 | Steve
Hello all you knowledgeable people. Got a customer who makes components. Asked the question what are manufacturers of components plating their lead with? Tin? Nickel? I heard possibly Paladium but don't know much about paladium. And of course the big
Electronics Forum | Mon Jan 03 12:26:16 EST 2005 | barryg
We are looking at potentially doing a pcb that is enig finished as called out on its fab. drawing. We plan on a standard 63/37 water soluble paste. Is there any pro's and cons to this process with a pcb plated as such. What is the main advantage that
Electronics Forum | Fri Jan 21 00:51:56 EST 2005 | WDLau
Hi All, could anyone advise me what we need to pay attention to if we will be usingthe Sn Pin plating as lead free requirement in SMT reflow process, is it a need to increase the Temp Profile by 10~15 Degree c as Sn with Melting ppoint 232C, Please
Electronics Forum | Tue Mar 01 10:21:55 EST 2005 | davef
IPC Plating Committee is presently working on a specification for immersion tin [IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards] as a solderable surface finish. Immersion tin is normally deposited at 30 to 60 microinches.
Electronics Forum | Tue Nov 01 03:38:36 EST 2005 | Slaine
we have two desk top XRFs and i would strongly recomend the desk top version over the hand held, its a lot more features and is more acurate. XRFs were mainly used for mesuring plating thiknesses before RoHS, and if your looking to use one most plati
Electronics Forum | Mon Dec 12 14:04:33 EST 2005 | craigj
Hi All was wondering is there anything I should be aware of or look out for if using parts with SnBi (Pb free) lead plating with Sn/Pb/Ag solder paste? I was always lead to believe that mixng lead and bismuth caused problems or are the bismuth levels
Electronics Forum | Mon Feb 27 09:31:10 EST 2006 | Slaine
on sections ive looked at with 7 microns of silver and 4microns of copper, the silver had been totally absorbed into the solder in most places and a large amount in some places all the copper as well, so i think the answer is that to provide long ter
Electronics Forum | Thu Jul 06 02:36:31 EDT 2006 | visitor
I have question,is this the only Ag/Pd component in your board? If yes then concentrate on this component, I would suggest evaluating other component of the same value with Tin terminations. If I am not mistaken Ag/Pd plated components termination
