Electronics Forum | Sun Feb 23 15:20:26 EST 2003 | davef
We section no bare boards at incoming. If we have a problem that needs investigation, our suppliers do the sectioning for us. If we didn't trust their analysis, we'd: * Get a new supplier. [There is tons of capacity in this industry.] * Use an ind
Electronics Forum | Tue Feb 25 10:32:09 EST 2003 | davef
I don't know the precise scheme, but it goes something like this ... WHAT TO DO * Use the general work instruction that applies to all boards. It goes into dimension and hole checking processes. It talks to visual instection of solder mask, solder
Electronics Forum | Mon Mar 03 08:33:54 EST 2003 | msivigny
Hello bphillips, I'm not surprised you're having difficulties with this size chip. As technology advances in product development continue to shrink package and real-estate size, the equipment and its automation must continue to perform it's desired f
Electronics Forum | Tue Apr 08 18:15:14 EDT 2003 | kent_peterson
Running the PAM board is a great tool. Using another machine to get you CPK is very inportant. We use the DT651 which does everything the PAM rom card does plus it gives a CP and CPK value. You can also use it to verify feeders in the X and Y. SMT re
Electronics Forum | Tue Mar 11 13:42:07 EST 2003 | MA/NY DDave
Hi As I got thinking about your problem, as you stated it, I am wondering if maybe we have some oxides or too thin of a Gold Immersion layer so that some of the underlying NI is being oxidized. The colorization that you described is what intriques m
Electronics Forum | Mon Apr 28 09:59:04 EDT 2003 | davef
Your customer's question is reasonable. Soldering to nickel is not always a walk on the beach [can of corn, or whatever]. This issue is flux not solder. Your Sn63 will have plenty of strength, providing the solder connection is well formed. You s
Electronics Forum | Thu May 08 09:00:03 EDT 2003 | stefwitt
I like to find out more about your feeder manufacturer. Known problems: If the cover tape peel back is located in the pick up window, the tape may lift the component out of the pocket and when the component falls back it could be inverted. The co
Electronics Forum | Tue May 13 06:57:10 EDT 2003 | davef
Your vendor site is totally correct. 2Ag is an excellent solder, but it does nothing to prevent tin and gold from reacting chemically. An earlier poster is correct gold goes into solution in liquid solder very fast, less than a second. Gold and ti
Electronics Forum | Fri Jul 04 01:32:15 EDT 2003 | rheise
I've seen numerous incidences of mirror image cracking under endcaps in high dielectric material ceramic capacitors due to thermal cycling. If the cracking is deep enough to extent through the plates you can get breakdown and shorting. Section the ca
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
