Electronics Forum | Wed Feb 18 12:32:59 EST 2004 | babe
A hot plate should do it. Since your throwing the board away a good hot plate could get you to just above reflow topside and you could remove them all at one time. To do this however the bottom side of the board would probably be damaged, but you don
Electronics Forum | Tue Jul 27 11:34:05 EDT 2004 | C Lampron
Nippy, This is exactly what we are seeing. The exessive pads are all on one side of the board. This is a 10 up panel 5x2. All of the QFP's on one side on the panel are not releasing or are not gasketing and causing bridging. So the defects are rangi
Electronics Forum | Tue Aug 17 13:24:47 EDT 2004 | blnorman
We have parts that have electroplated tin over nickel. The mfg. assures us the minimum thickness of the tin is 5 microns. Cross sections have shown many instances of 1 micron and pits that go down to the nickel barrier layer. A request for thicker
Electronics Forum | Thu Sep 02 22:23:44 EDT 2004 | davef
Dunno about something formal. After you specify your hole size and fill material, why not say something like: " Surface to be planar prior to final plating and metallization. Boards must be suitable for via in pad technology." We do not allow plati
Electronics Forum | Thu Sep 02 18:39:48 EDT 2004 | steveg
We're having a lot of problems with failed solder joints to gold-plated MOSFET leads. Gold plate thickness spec is 60uin, but we've seen as much as 200uin in cross-section, so we're obviously concerned about gold embrittlement issues. Pre-tinning w
Electronics Forum | Sat Nov 06 07:22:36 EST 2004 | Steve
Hello all you knowledgeable people. Got a customer who makes components. Asked the question what are manufacturers of components plating their lead with? Tin? Nickel? I heard possibly Paladium but don't know much about paladium. And of course the big
Electronics Forum | Mon Jan 03 12:26:16 EST 2005 | barryg
We are looking at potentially doing a pcb that is enig finished as called out on its fab. drawing. We plan on a standard 63/37 water soluble paste. Is there any pro's and cons to this process with a pcb plated as such. What is the main advantage that
Electronics Forum | Fri Jan 21 00:51:56 EST 2005 | WDLau
Hi All, could anyone advise me what we need to pay attention to if we will be usingthe Sn Pin plating as lead free requirement in SMT reflow process, is it a need to increase the Temp Profile by 10~15 Degree c as Sn with Melting ppoint 232C, Please
Electronics Forum | Tue Mar 01 10:21:55 EST 2005 | davef
IPC Plating Committee is presently working on a specification for immersion tin [IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards] as a solderable surface finish. Immersion tin is normally deposited at 30 to 60 microinches.
Electronics Forum | Tue Nov 01 03:38:36 EST 2005 | Slaine
we have two desk top XRFs and i would strongly recomend the desk top version over the hand held, its a lot more features and is more acurate. XRFs were mainly used for mesuring plating thiknesses before RoHS, and if your looking to use one most plati
