Electronics Forum: plating (Page 111 of 252)

BGA placement on PGA

Electronics Forum | Fri Nov 08 17:49:04 EST 2002 | davef

Questions are: * So, what is your thinking on this "insufficient contact causing intermitten failures"? * How do you print the paste? * Where do you place your therocouples when measuring reflow temperature? * What kind of solderability protection is

smt components vs. wave solder

Electronics Forum | Sat Nov 09 15:13:06 EST 2002 | mjabure

If I understand what you're saying, you are reaching reflow temp's on the top side while soldering bottom side components. You might want to run a glass gauge plate over the wave and make sure your contact pattern isn't too large. If your PCB is in c

Plated through via's in pads.

Electronics Forum | Wed Feb 05 11:21:24 EST 2003 | pjc

First off, get them designed out. I had this problem once and filled them with SMD adhesive and cured prior to printing. We were careful to be sure the solder lands were clean of any adhesive prior to curing. It worked out very well and we did this p

Plated through via's in pads.

Electronics Forum | Mon Feb 10 05:32:44 EST 2003 | matherat

BPan, I would like to discuss a possible solution to this that involves some of the suggestions found here but, with a twist that our process offers. This would be better discussed one on one somewhere other than this forum so if you still need sugg

Plated through via's in pads.

Electronics Forum | Mon Feb 10 15:39:20 EST 2003 | bpan

Thanks for all the info guys. Dont think that the problem is a thermal one and I believe the guys designing the board just need to design them out. I have directed the customers we get the boards from to read this posted question so that they could s

Black pad defect

Electronics Forum | Wed Mar 19 19:02:39 EST 2003 | Jodi Roepsch

From my experience, we have had little success in reworking boards with the black pad condition. In one instance, with several reworks, we were able to get plated through holes with the defect to take solder but the joint reliability was highly ques


Electronics Forum | Thu Mar 06 14:10:26 EST 2003 | gregp

Hello Mike, The IPC has recently released a specification (IPC-9850) that characterizes the performance of placement machines. The process is very similar to the process you describe (placing parts on a glass plate and measuring the results). The I

Voids in solder fillet

Electronics Forum | Thu Apr 17 14:14:17 EDT 2003 | davef

Takfire Questions are: * Why does your customer think the capacitor is the issue? [What are we thinking? Of course the capacitor is causing this voiding problem. What else could it be?] * What are the type, construction, end-cap material and plati

Tombstone defect

Electronics Forum | Wed May 07 09:02:17 EDT 2003 | Kris

Hi SnAg is a binary alloy and does not have the same effect as a ternary SnAgCu alloy as far the pasty range is concerned. But then paste only can do so much. The best way to do it is to have proper pad design, controlled placement and reflow. I w


Electronics Forum | Mon Apr 28 16:36:11 EDT 2003 | razor

Component: Termination (barrier) NI, 120/3.0 um Solder Plate (outer) 90% Sn, 10% Pb, 120/3.0 um Solder: Multicore CR39, 95.5%Sn/3.8%Ag/.7%Cu @ 6mil Flex PCB: Cu, Ni, Au .2m to .5m Thanks

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