Electronics Forum | Tue May 07 02:58:27 EDT 2002 | dwoon
Hi, We are looking for some measuring machines to evaluate the ability of a SMT placement machine to produce quality. We will mount some dummy components on a glass plate and then insert the assembly into the measuring system which can measure the
Electronics Forum | Tue May 07 17:24:43 EDT 2002 | stefwitt
Most machine supplier have CMM's and proove their accuracy with attached protocol of CPK. We used to have a machine from View Engineering. I can not locate their website, I only found a used machine. http://www.equiptechonline.com/PDetail.cfm?pid=17
Electronics Forum | Fri Jul 26 17:02:07 EDT 2002 | davef
Never heard of flux residues forming a lense. The first thing that comes mind when thinking about your 'fog test' is: Ionic Contamination While this seems pretty far afield from your interest in optical effects, I'll continue briefly. A reverse
Electronics Forum | Thu Aug 01 10:09:31 EDT 2002 | sueph
Dave, I would have never thought of the sheet metal box. My west coast contact, who has dealt with this type of board before, told me yesterday to go ahead and try it at this profile anyway, as the metal plating holds more heat. I was pleasantly
Electronics Forum | Thu Aug 29 07:46:39 EDT 2002 | nifhail
Hello Experts We ran into problem today when one of the board that we assembled having problem at Test, BGA failure. The joints looks good but no continuity. When trying to remove the BGA, i found that the pad on the PCB is intact but black in colou
Electronics Forum | Thu Aug 29 17:51:43 EDT 2002 | nifhail
I have seen several Imm Ag pad on the assembled board which have a copper colorleaching through the silver plating This happened on the pad which was not deposited with paste during the assembly process. Don't know if it is a problem, but we only h
Electronics Forum | Thu Sep 19 17:14:02 EDT 2002 | davef
Comments are: * Use an eraser if the surface of Au is not clean, but make sure the eraser has no/low ionics (such as sulfur that is a common additive for rubber). * If the plating surface required eraser to remove the top surface, the plasma normally
Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.
unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-
Electronics Forum | Wed Oct 02 18:18:58 EDT 2002 | davef
The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This provides for setting your peak based on the
Electronics Forum | Mon Dec 16 10:54:48 EST 2002 | davef
Knee of barrel and pad crack: Caused by thermal stress during soldering, because epoxy expands in the "z" 3X more than "x" or "y" which are restricted by the fiber. Related to: * Design of pads too large relative to hole diameter * Temperature at o
