Electronics Forum: plating (Page 161 of 252)

Patented Leadless, Fluxless Solder Alloy join different material

Electronics Forum | Thu Jan 20 00:22:07 EST 2011 | yangloh

Dear Industry experts, We have just developed a leadless, fluxless solder that can join various metals ) Al, Cu, brass, Steel, stainless and Titanium) and Ceramics ( Ruby, Quartz, Sapphires, glass, TiO2, etc) We intend to explore electronics and

BGA solder bridge - Adding Pictures

Electronics Forum | Mon Mar 21 17:36:44 EDT 2011 | davef

Kim: You could be correct. We had a batch of BGA that had a weird bridging pattern. Could not figure it out. So, we put the whole batch straight out of the 'box' bug-up on a hot plate and video recorded the balls as we took them through a thermal cy

FLexJet pickup problems

Electronics Forum | Thu May 12 18:32:02 EDT 2011 | jbaez1

Also... this is ONLY a pick issue? No issues with > placement for those that you do successfully > pick? > > Have the spindles been calibrated > lately? Hi Vickt! thanks for your comments,,during step mode no failure at all, the spindle moves d

DPAK drop @Second reflow

Electronics Forum | Tue May 31 22:40:24 EDT 2011 | bejrananda

HI All, Please kindly advice me, I have project that it has DPAK part (MPN:SUD25N15-52 E3 Plating:100% Sn matte)which locate on bottom side (1st reflow), Good wetting for 1st reflow.. but .. when I run Top side (2nd reflow).I found that this D

QFP footprint -extended outside pad?

Electronics Forum | Fri Sep 16 08:01:06 EDT 2011 | davef

We see no advantage to extending the toe-end of pads. Hell, 90 percent of the time the numb-end of the toe of the component lead isn't plated. So, it doesn't take solder. Further, solder on the toe adds little, if anything to the strength on the sold

Sn100C Plating, Mixed Alloy Scenario

Electronics Forum | Tue Dec 13 15:00:31 EST 2011 | davef

Contaminating lead-free solder connections with lead is generally a bad idea, but that's not what you plan. You plan to add tin to your tin-lead solder connection. We don't think there is a significant problem for most applications. Adding tin will

SMT Rework for metal core PCB's

Electronics Forum | Tue Jan 03 11:01:19 EST 2012 | julie331975

We are working with .065" thick metal core PCB's. I have a couple boards that are in need of rework. The components we are placing are similar to a SOJ package with a solder pad underneath the component. We are also using a lead free process. I have

Nickel/Hard Gold thickness

Electronics Forum | Mon Feb 27 09:31:30 EST 2012 | pauld

Hi Dave, Picture a camera mounted on top of a fixed base that pans 360 deg. back and forth. The motor connects through a circular slip ring board with brush connection. The rings are hard gold and the typical brush material is soft. Unlike the armatu

Unsoldered gold pads on unleaded wave solder process

Electronics Forum | Wed Jun 13 16:51:26 EDT 2012 | davef

Sorry, but I don't have a quick and easy answer. Before jumping the 'black pad shark,' tell us more about your boards ... * Is the gold still on the pads after soldering? * Can you make the pads take solder using a soldering iron? * Does this happen

Unsoldered gold pads on unleaded wave solder process

Electronics Forum | Thu Jun 14 04:24:32 EDT 2012 | brettrenishaw

Yes pads are still gold after the wave soldering process even if you wave solder a pcb several times. I have tried soldering using an iron and the solder takes to the pad as you would expect. This happens on all boards of this type and all boards are


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