Electronics Forum: plating (Page 221 of 260)

Re: 0402's Tombstoning

Electronics Forum | Thu Oct 14 18:02:31 EDT 1999 | JohnW

Bryan, 0402's tombstonning isn't that uncommon and usually the 1st reaction is alway's the pad size aint right. If you've followed the IPC guidline's normally you should be fine but I'd double check the component supplier's spec's as well. brian's p

Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Electronics Forum | Wed Sep 29 23:54:07 EDT 1999 | Dreamsniper

Hi everyone, Greetings! I�ve got a 2-layered through-hole PCB�s having the following problems: Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB Insufficient Solder and some solder never make it to t

Re: Contamination causing shorts.

Electronics Forum | Sat Sep 25 07:07:02 EDT 1999 | Brian

| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | There are several different mechanisms which can cause this. In reality, ionic contamination is the root cause for many of the

Re: PCB Support Methods @ the Fuji.

Electronics Forum | Wed Sep 22 20:57:46 EDT 1999 | JAX

| | Question for you SMT guru's out there. | | | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following methods: |

Re: Soldering to Gold

Electronics Forum | Thu Sep 16 20:55:35 EDT 1999 | Dave F

| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Re: Time to use alternative finishing ???

Electronics Forum | Fri Sep 10 15:32:30 EDT 1999 | Earl Moon

| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with

Re: how to overcome tolerance in automatic alignment

Electronics Forum | Thu Sep 09 09:13:10 EDT 1999 | Scott Cook

| hi, i m college student. i m currently doing my Final year project in PCB drilling. the main task is to design auto feeder which allign the PCB properly in position before drilling take place. the close tolerance becomes a big problem to the precis

Re: Solder Beading Solder Balling

Electronics Forum | Thu Aug 05 11:15:39 EDT 1999 | John Thorup

| | | | | | | | | Hello, | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip compon

Re: Optimizing PCB for SMT

Electronics Forum | Fri Jul 16 14:34:18 EDT 1999 | Glenn Robertson

| We are converting from COB to SMT on a product line and want to optomize the PCB as far as Laminate, plating, passivation etc. This is a high temp application 150C. We are presently using BT Laminate but would like to get away from this. We are

Re: Through holes in SMT pads

Electronics Forum | Tue Jul 06 17:03:46 EDT 1999 | Earl Moon

| Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. Th


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