Electronics Forum | Mon Aug 09 20:47:21 EDT 2004 | KEN
I think OA flux left on the pot would quickly looses its activity and become part of the dross waste stream, and smoke stream for that matter. Also, if your wave is setup properly your selective pallets will scour (push) the top of the lambda wav
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Thu Sep 02 10:51:45 EDT 2004 | patrickbruneel
Hi Ken, Thank you for the reply Ken. I hope I don�t get my behind in trouble for subject change in this thread. But you hit the nail on the head in your comment with Hitachi, when they converted to lead-free they had a �5 times higher defect rate� i
Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN
I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f
Electronics Forum | Wed Sep 15 23:15:55 EDT 2004 | pdeuel
Im with Pete, Zero defects. We have high defect rate for many reasons. No line tech, operators set up and run then when QA reports defects engneers are called. Not to make people mad but our process engneers are lacking practical experance to fix pro
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
Electronics Forum | Sat Dec 04 18:55:38 EST 2004 | Grant
Hi, Yes, all you really need to do is boil the fluid while suspending the PCB above the vapor, so it's quite easy. However I would recommend against dropping the board direct into the vapor cloud, as that would be a very fast warm up, while letting
Electronics Forum | Wed Nov 17 09:51:25 EST 2004 | AS
I'm looking for advise on setting up a prototype station for smt (we are currently outsourcing smt production, but have a need for rapid in house prototyping). The station must be able to handle only single sided boards with components no smaller th
Electronics Forum | Mon Feb 28 12:17:49 EST 2005 | lyrtech
TO JAY: What type of assemblies are you having 50-75% fill on. - Capacitor, resistor Are they single sided? - Yes Plated through hole? - No Is this a recent problem? - Yes, first time, but we don't know how long it last. TO RUSS: What is your t
Electronics Forum | Tue Mar 15 22:04:56 EST 2005 | KEN
The hasl joint looks fuller (and is easier to inspect)because it has more solder volume. Think about it. Your pre-plating your board with solder (before you add more solder). I doubt your getting 0.3 mils of hasl.....probably more like 1.3 to 3.0
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