Electronics Forum: plating (Page 96 of 252)

Cracked MLCC's

Electronics Forum | Mon Aug 19 09:42:41 EDT 2019 | edhare

Dave, Perhaps, but my interpretation of that photo is that it simply shows a knit line fracture that propagated out to the surface. The fact that it shows on the termination is not surprising since the termination wraps around the internal plate st


Electronics Forum | Tue Mar 17 10:47:56 EDT 2020 | davef

IPC-1601 covers PWB bake-out, methods for determining optimum bake time and temperature, caveats for certain PWB plating finishes, etc. IPC-1601 is to bare boards as J-STD-033 is to components

Re: Fillet Lifting

Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary

The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate

Re: 2% silver solder paste

Electronics Forum | Thu Apr 22 17:19:57 EDT 1999 | JohnW

We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t

Gold Surface Finish on PCB's

Electronics Forum | Wed Dec 14 07:34:33 EST 2005 | davef

Mike Ozzy If I came to your house, I wouldn't punch you. I'd make you buy me beer. Vern Solberg; Tessera Technologies Inc., 3099 Orchard Dr, San Jose, CA 95134; 408 568 3734 F408 894 0768 vsolberg at tessera dot com. If that doesn't work try: Tes

Selective moving pot vs fixed pot

Electronics Forum | Thu Jul 10 13:34:43 EDT 2008 | rwyman

We have a Vitronics mySelective machine (model 6749, or "the Fat Bastard" as we affectionately call it). It's configurable with various combinations of "select wave" and "multi wave" pots. Ours has one of each. The "select wave" is for the most pa

Re: Qualifying new PWB Vendors

Electronics Forum | Fri Jan 15 15:17:21 EST 1999 | Earl Moon

Hello, We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. So far, the tests I can think of performing, and tha

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 21:24:27 EST 2000 | Dave F

Glen: As I mention in an earlier response in this thread, I think someone at Steve's plant (or may be in his packaging spec for the fabs) is doing something to leave a residue, but I'm also thinking solder mask ... ENIG can be applied before or aft

Re: Press fit connnector

Electronics Forum | Wed Feb 09 21:45:48 EST 2000 | Dave F

Sal: Hey that customer standing around staring at you sound like fun, yeh right!!! Wolfgang makes good sense, but, in addition, I�d like to drill-down on board fabrication (har har har) a little bit (har har har) more. You say the holes are the cor

Re: BGA problem: open after reflow

Electronics Forum | Mon Nov 06 09:38:55 EST 2000 | Dean Stadem

We have seen this problem several times. It always goes back to pad solderability, very seldom does it have anything to do with ball size. If there is no evidence of wetting on that pad, but all of the other pads did solder, you need to ask yourself

plating searches for Companies, Equipment, Machines, Suppliers & Information