Electronics Forum | Mon Feb 27 09:09:36 EST 2006 | davef
Silver on your copper or brass part is a solderability protection. The silver diffuses into the solder and you solder to the base metal, either the copper or brass in your case. Soldering to copper is well known. The issues are soldering to brass
Electronics Forum | Tue May 28 16:19:52 EDT 2002 | zanolli
Hello Floyd, Yes, special tooling is required. The tooling usually consists of a press, push-in tooling and support plate tooling. The presses can range from relatively simple arbor type presses to automated hydraulic presses with sophisticated con
Electronics Forum | Mon May 14 19:16:49 EDT 2001 | jagman
Dave: Actually, I'm located in the South Bay (Santa Clara)! Good guess. Now, for more in-depth information: So far, the distribution has been limited to one board out of 10 assembled, so far from one lot. The components assembled are exclusively
Electronics Forum | Mon Dec 06 14:56:49 EST 1999 | Russ
The best way that I have found to calculate CPk for placement machines is to buy the kit that is usually provided by the manufacturer of machine. It usually consists of a glass plate and glass components that are scaled. You simply program the mach
Electronics Forum | Mon Jul 10 04:16:03 EDT 2006 | dougs
Hi, We have a new product coming soon that has a fair number of PTH sockets and headers. I was thinking that it would be good to use intrusive reflow on some of them to even up cycle times between SMT and hand insertion, however, when i called t
Electronics Forum | Thu Jun 25 14:41:07 EDT 1998 | Earl Moon
| Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handb
Electronics Forum | Fri Jun 26 11:27:12 EDT 1998 | Earl Moon
| | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Han
Electronics Forum | Fri Jun 26 15:37:50 EDT 1998 | Justin Medernach
| | | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection H
Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef
The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h
Electronics Forum | Thu Apr 22 14:31:39 EDT 1999 | Dave F
Michael: Two things: 1. Profile: A. Your FR4 profile will not produce good solder connections on your ceramic substrate. Hey wait a minute, you soldered FR4 at 250C?? Ceramic is a themal sponge. You'll need to play, but it should be easy compare
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