Electronics Forum | Tue Dec 13 19:33:06 EST 2022 | proceng1
Does yours have the removeable hard drive that unlocks with a key and the whole thing comes out? Try plugging the HDD directly in, and don't use the adapter part. It's kind of tricky, but I was told by the service techs that a bunch of those adapt
Electronics Forum | Thu Mar 23 13:36:30 EDT 2023 | tomdegas
Running a Mydata MY 9 and trying to Restart the machine and try to initiate the hardware, get an error message of F-MOT-MSETDYN X/163: Illegal value of DSP command argument. It seems to be related to the x drive. I've check all the connections on
Electronics Forum | Mon Feb 22 03:13:56 EST 2016 | sarason
Try PCBSynergy. It does VIOS, both versions, can read 10 CAD formats does the Philips CAD2CAD interchange format(*.CAD)doesn't work from Gerber files but does interface to Visualplace which does, which in turn interfaces to PCBSynergy. PCBSynergy is
Electronics Forum | Tue Jan 06 08:05:33 EST 2004 | stefwitt
The manual is a bit more specific: Connections and Energy Requirements Specification for the Compressed Air For the compressed air supplied for the automatic placement systems HS-180 (adhesive application station as well as placement station) and SP
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Sat Jan 20 17:41:11 EST 2007 | bvdb
Hoping someone can help us. Our Fuji IP-1 won't boot up unless we disconnect the 25 pin RS232 connector that runs to the MCS16/F programming computer. It doesn't matter if the 9 pin connector on the other end of the cable is plugged into the MCS16/
Electronics Forum | Tue Jul 27 16:44:31 EDT 1999 | Earl Moon
| | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | 12BGA per assembly | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | Pads .014inch | | | Vias within footprint .020inch | | | Vias to be filled by bottom side(sol
Electronics Forum | Tue Jul 27 17:23:45 EDT 1999 | M.L
| | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | 12BGA per assembly | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | Pads .014inch | | | | Vias within footprint .020inch | | | | Vias to be filled by b
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
