Electronics Forum | Tue Aug 31 17:39:26 EDT 2010 | jeffjarmato
Follow the manufacturers reflow spec in the application guide.
Electronics Forum | Wed Jul 17 12:30:26 EDT 2002 | Mike Proffitt
I am working to improve the yield on a SMT line and am trying to find out a benchmark figure, anyone who could guide me to the expected yield for soldering related issues on a board containing approximatly 4000 joints I would be very greatfull.
Electronics Forum | Mon Sep 17 10:11:26 EDT 2001 | jstarkweather
What is the tightest spacing that you have assembled 0201 components? Under what assembly scenarios did you produce the best/worst yield at this spacing?
Electronics Forum | Thu Nov 09 16:38:26 EST 2006 | Julie
Our SQE's want to benchmark the first pass yield requirements that we place on our CM's - currently they are at 95% - does this seem reasonable?
Electronics Forum | Thu Jun 08 09:26:26 EDT 2023 | frankchan
placement> (curing)> reflow soldering> cleaning> inspection> rework SMT production process Surface mount process a. Single-sided assembly: (All surface-mount components are on one side of the PCB) Incoming inspection-solder paste stirring-screen prin
Electronics Forum | Sun Dec 26 21:24:55 EST 2004 | tellinghuisen
Dreamsniper What is the rationale for the double plugging? And why from both sides?
Electronics Forum | Tue Aug 16 20:10:26 EDT 2022 | servin6154
Make sure that your HOD is plugged in all the way.
Electronics Forum | Thu Aug 29 12:48:26 EDT 2002 | slthomas
Assuming all things are equal (attention to good DFM guidelines, well trained and capable operators, well maintained equipment, etc.), which would you expect to have the higher process yield, standard SMT/through-hole all topside, or all SMT bottom (
Electronics Forum | Wed Nov 21 15:02:46 EST 2007 | jlawson
From info I have been told from design standpoint, via in pads helps with managing EMC issues with working design, in particular for high speed digital/dense populated type PCB's. We had a manufacturing customer that had very low yield because of th
Electronics Forum | Mon Jul 26 12:55:34 EDT 1999 | M.L
Presently protos of micro-bgas (80i/o) pitch .030/.031 12BGA per assembly The board is a (.062, 4 layers) FR-4 using Dry film Pads .014inch Vias within footprint .020inch Vias to be filled by bottom side(solder side) only .030in dia. Force via plugg
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