Electronics Forum | Mon Feb 22 10:19:23 EST 1999 | Mattias
Hello Is there anyone who can give me some information regarding yield from gluing 0603 Is there any other problems that you might have had.
Electronics Forum | Tue Aug 31 17:39:26 EDT 2010 | jeffjarmato
Follow the manufacturers reflow spec in the application guide.
Electronics Forum | Tue Aug 31 04:33:41 EDT 2010 | eyalg
We are facing 50% yield soldering Linerar (uModule) DC/DC LGA. The failure is characterized as "flactuation of output voltage." Can some one had the same failure?
Electronics Forum | Mon Feb 22 15:46:05 EST 1999 | Earl Moon
| Hello | Is there anyone who can give me some information regarding yield from gluing 0603 | Is there any other problems that you might have had. | | We glue bottom side 0603's but have changed our pad spacing to accomodate tolerance requirements
Electronics Forum | Tue Apr 27 07:20:34 EDT 1999 | Richard Marks
I'm a mechanical engineer and we buy electronic pressure sensors and switches. In doing quality audits, I need to understand what "best practice" will yield in terms of conforming product first time through the manufacturing process? Any data out t
Electronics Forum | Tue Apr 27 09:31:45 EDT 1999 | Robert L. McCallum
On circuit board assemblies first pass yields need to be above 98%, if a supplier is below this level it is a indication that: he has poor control of the manufacturing process; Poor component selection (price over quality; excepted a poor design from
Electronics Forum | Wed Nov 21 15:02:46 EST 2007 | jlawson
From info I have been told from design standpoint, via in pads helps with managing EMC issues with working design, in particular for high speed digital/dense populated type PCB's. We had a manufacturing customer that had very low yield because of th
Electronics Forum | Wed Aug 24 08:50:59 EDT 2005 | davef
First, while black pad can be a problem with poorly controlled electroless gold [search SMTnet Archives for background], it is not a suffiecient reason to use electrolytic. It's the reason the supplier should fix their electroless gold process. Se
Electronics Forum | Fri Nov 24 09:15:30 EST 2006 | davef
Julie: What is the benefit of your SQE requiring that your CE meet your first pass yield targets?
Electronics Forum | Wed Jan 05 12:48:44 EST 2000 | Dave F
Millerin: You are generally correct about plugging and over plating vias, but in Michaels case, the via is blind. Plugging would trap air between the bottom of the via and the plug material, causing an air pocket. When heated to soldering temperat
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