Electronics Forum | Fri Apr 12 17:22:47 EDT 2002 | davef
First, splitting hairs on parlance. * Conformal Coating. A thin electrically nonconductive protective coating that conforms to the configuration of the covered assembly to provide environmental and mechanical protection. * Solder Mask. Coating mate
Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
Electronics Forum | Wed Mar 28 11:27:32 EDT 2007 | jmelson
Hello, I was the guy asking about doorway size for a Philips CSM84. Well, we cut the doorway using the best info we could get, and managed to get the machine inside with only a few scratches on the paint! Still no door, hopefully the fabricator wil
Electronics Forum | Wed Aug 09 22:11:46 EDT 2000 | Dave F
Mark: The best routing of test vias for BGAs is to keep them far away from the device. We route test pads for the outer two rows of balls and use vias as test pads for the inner rows of balls. Your bottom-side layout is fine. Yes, on the top-side
Electronics Forum | Thu Apr 19 11:04:43 EDT 2001 | Spanky
All, We are getting ready to start running with 0201 passives. I have never run these before. We have run some 0402s however. We don't have any assemblies in-house yet, so I can't give any intelligent information regarding the board design (size,
Electronics Forum | Wed Jun 20 09:19:14 EDT 2001 | Gil Zweig
Dave: Your question is very astute. First let me make the observation that x-ray imaging is a technology that not many people in electronic fabrication are familiar with (but some think they are); consequently they are gullable acceptors of sales dis
Electronics Forum | Mon Jul 30 12:14:00 EDT 2001 | hinerman
1. The grid-lok technology affords itself the flexibility to come in a variety of heights. The list of machines given are customers we are working with currently. Please contact me offline at jhinerman@ovationproducts.net if you have a specific app
Electronics Forum | Tue Jan 25 21:59:44 EST 2000 | Dave F
Michael: On reliabiliity, consider that: � IPC-SM-782, "Surface Mount Design And Land Pattern Standard" and IPC-D-279, "Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies" specifically describe via in pads as "poor des
Electronics Forum | Tue Nov 30 16:50:20 EST 1999 | Dave F
Greg: It depends on the specifics of the flux you are using. You didn�t say. Generally, using a: � "No-clean flux" should create no flux entrapment problems for most applications. � RMA with 25% or more solids as a "no-clean" should create no flu
Electronics Forum | Fri Oct 08 16:36:28 EDT 1999 | Glenn Robertson
| We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 7
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