Electronics Forum | Fri Jun 09 17:34:08 EDT 2000 | Melanie Mulcahy
I need some information regarding the acceptability/unacceptability of using tented vias with LPI soldermask. Long story on all involved, but basically I have a board that I have had manufactured with no problems which has BGA/uBGA parts, tented via
Electronics Forum | Thu Sep 16 18:59:14 EDT 2004 | Carol
Thanks Everyone, the information was very useful. We use 7095 as a bible. A-610 6.5.3 doesn't allow for any solder balls not entrapped/attached etc. so we will look again at plugging/tenting both ends of the via. We ran into the problem of the mask
Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol
During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,
Electronics Forum | Tue Sep 14 19:47:16 EDT 2004 | davef
use something other than HASL. "The rest of the world seems to be processing with no problems..." [Hello!!! Earth to Carol. This is a test.] Things you are considering could be more trouble than they�re worth. "1) Reduce via hole size" [If you re
Electronics Forum | Thu Dec 21 13:33:46 EST 2006 | ppcbs
The problem with super glue is that is has a cyanide base that turns into a toxic gas and evaporates when heated. See IPC-7095. Via's should be fully plugged with solder mask at the fab house. If your PCB designers are not up to speed on IPC requi
Electronics Forum | Fri Aug 22 09:44:45 EDT 2003 | davef
Kenny: Since you need to use water soluable flux and can't use no-clean, consider asking your board fabricator to plug the via.
Electronics Forum | Fri Aug 22 09:41:49 EDT 2003 | davef
Mantis: Kenny reflows paste on [wave solders] all via, not just the test via, to plug the via and provide for a pressure seal between the board and the test fixture. Beyond that, since solder is softer than copper [and fills the hole better], solde
Electronics Forum | Thu Dec 07 00:55:51 EST 2006 | billylim
As you are aware the common method to rework BGA is : 1. Remove BGA with hot air reflow machine ( SRT as current practice) 2. Clean the BGA pad using solder iron and solder wick. 3. Replace BGA with SRT rework machine. The problem we have with
Electronics Forum | Sat Jul 11 03:01:29 EDT 2020 | researchmfg
The bubble inside BGA ball locate at via in pad and apply the resin plug hole.You shall check the cooper plating quality on PCB pad. If there is thin plating or broken on the pad then air will come from the resin plugged via and be trapped inside the
Electronics Forum | Tue Jul 15 16:12:23 EDT 2008 | boardhouse
Hi Armynski, I sell for an offshore board house, yes, it is common for offshore board shops to fill vias. The bubble is caused by air entrampment within the hole it self, when heat is applied during Hot air and the via is covered on both sides the e
winsouce.jpg)
