Electronics Forum | Mon Mar 12 11:27:35 EDT 2007 | coop
I am not using a solder pallet, I don't think the problem is contamination related, because these parts are on some of our other assemblies, and they're being waved with no problems. The problem seems to be mainly on our panelized boards for some rea
Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10
Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh
Electronics Forum | Thu Aug 25 10:17:48 EDT 2005 | davef
Send the pic to dave5252 at hotmail.com [you can't send pic through the SMTnet email thing] For more on via plugging, tenting, capping ... look here: http://www.merix.com/technology.php?section=processes&page=pdf/Via_Fill_Plug.pdf Something, a voi
Electronics Forum | Mon Mar 07 10:14:31 EST 2005 | jmedernach
Cellular and PDA architectures employ this technology all the time. You have to be careful with your board supplier as well as with your plugging approach. Leave the via unplugged, I guarantee voids in the solder joint. That leaves us with, "how d
Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
Electronics Forum | Sat Jul 11 05:50:09 EDT 2020 | rsatmech
Thanks for your valuable inputs. I will work to apply resin plug hole in issue pcba.
Electronics Forum | Sat Jul 11 03:01:29 EDT 2020 | researchmfg
The bubble inside BGA ball locate at via in pad and apply the resin plug hole.You shall check the cooper plating quality on PCB pad. If there is thin plating or broken on the pad then air will come from the resin plugged via and be trapped inside the
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Fri Jul 13 18:25:09 EDT 2007 | seankim10
It sounds like more has to do with plating. you may also check out the voiding issue especially if you have new FAB or the supplier. I had problems with a RF chip in QFN package due to insufficient grounding that voiding caused. This ground is often
Electronics Forum | Thu Jun 10 06:15:45 EDT 2010 | muarty
We currently have a project requiring us to place multiple QFN devices (of various sizes). The pick an place is not a problem at all, where we are seeing 'problems' is that 3 of the devices are being place on locations where the ground pad have plugg
