Electronics Forum: poor and wetting and leadfree (Page 1 of 3)

Leaded and Lead-Free Wave Parameters

Electronics Forum | Fri May 23 18:55:20 EDT 2008 | gregoryyork

This is one of the biggest mistakes with the Lead Free process. We have all listened to the 'industry experts' and followed their advice and unfortunately got it wrong. Keep the dwell times (dependant on alloy selection) the same as Leaded so you are

Leaded and Lead-Free Wave Parameters

Electronics Forum | Thu May 22 14:44:10 EDT 2008 | samir

Does your top-side preheat NEED to be that high, and so high that you are exceeding the flux manufacturers' spec? If so, what is the reason? Top-side wetting? Are you measuring this temperature at the substrate or solder joint?

Leaded and Lead-Free Wave Parameters

Electronics Forum | Thu May 22 12:32:35 EDT 2008 | tonyamenson

So here is my problem with the info you gave. If my preheat topside max is 150 - 170 C but my flux calls out a topside temp of 93 - 104 C..... ....Im pretty much up a creek becuase of a poor flux choice? FYI. we are using the Indium 3590-TX for bo

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Tue Nov 06 22:37:35 EST 2012 | davef

Ryan ... "As for bismuth-based lead-free alloys, a lower melting temperature than that of tin-lead is offered together with a cost similar to that of tin [in the area of $3/lb]. Unfortunately, bismuth in soldering alloys tends to create embrittlemen

Solder beads and wave soldering

Electronics Forum | Mon Jul 10 09:25:47 EDT 2006 | nodlac

Here is a nugget from the Data Sheet... Wave Soldering: Excess moisture on the PCB during soldering may lead to random solder balling and poor wetting of some solder joints. IT IS IMPORTANT that the flux solvent carrier (water) is fully evaporated a

Leaded and Lead-Free Wave Parameters

Electronics Forum | Thu May 22 16:52:39 EDT 2008 | tonyamenson

Indium got back to me with the attached PDF. I always assumed, that in order to avoid thermal shock, there could not be any more than 80 degrees C difference between the solder pot and the pre-heated board. However, it would seem that any thing le

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 19:50:33 EDT 2012 | action_101

Hello, We're building some boards with 01005's and the only issue we are running into is the solder is not reflowing. It's the damnest thing, we are having no issues with the printing process or placing the components, the two areas we thought we wo

OSP finish and Omnix 5002 solder paste(SnPb)

Electronics Forum | Sat May 15 11:27:26 EDT 2010 | davef

We'd expect both OSP poor wetting and improper reflow recipe to show-up in more places than just this one component. But if those are the only choices, we'll go for 'wrong solder paste.' Ooops, that's not one of the choices. Ok, OK, we'll take poo

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert

I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i

Mix Pb and Pb free alloy

Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir

Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma

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