Electronics Forum: pop (Page 1 of 34)

POP Flux

Electronics Forum | Thu Dec 13 14:49:07 EST 2007 | 26560

Any recommendations/data on a superior flux to use for Package on Package assembly? Also, any guidelines on flux depth, viscosity, etc... are welcome.

POP Flux

Electronics Forum | Fri Dec 21 15:50:54 EST 2007 | rwyman

Hi smtdude- I'm no expert at PoP (yet!) as we've only done a few weeks worth of experiments for a new customer but what i can tell you is 25-50% of the ball height (not diameter) is a good rule of thumb for the flux depth, at least to start. I can s

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a

C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.

PoP parts

Electronics Forum | Tue Apr 15 18:49:37 EDT 2014 | hegemon

Evtimov, Are you talking about placing an already built POP package, or about building the POP package at the SMT line? 'hege

PoP parts

Electronics Forum | Wed Apr 16 19:17:11 EDT 2014 | hegemon

OK, POP already done, and you are mounting the POP device. You are seeing opens. Opens at the device/PWB? or opens at the device/device interface? Or possibly both? 'hege

Skewed and popped components

Electronics Forum | Fri Sep 26 12:57:09 EDT 2003 | Angie

We have had some components that popped off in our IR oven. It was attributed to the solder paste. The humidity was above 60% the temp was about 70 degrees.

Dye and Pry on PoPs?

Electronics Forum | Mon Aug 15 18:42:53 EDT 2011 | bandjwet

Does anyone have experience in doing dye and pry analysis on PoPs? A customer wants to know whether or not the board level or device-device interconnect is the suspect. What other technique can anyone recommend? BWET

PoP parts

Electronics Forum | Mon Apr 21 10:50:13 EDT 2014 | cyber_wolf

The top PoP part is what gets dip fluxed or dip pasted. We have had warping issues with these components before but it is almost always the top part. My guess would be bad components if your reflow profile and print process is good to go.

Pop can SMT stencils

Electronics Forum | Wed Jul 24 12:26:35 EDT 2013 | cyber_wolf


PoP parts

Electronics Forum | Tue Apr 15 16:16:25 EDT 2014 | rway

Can you attach a photo of said component? Reese

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