Electronics Forum | Wed Aug 12 18:26:16 EDT 2020 | SMTA-64387117
Looking for engineers to test new desiccant technology and compare with Silica Beads. Samples provided. Additionally, engineer can work with and collaborate with "engineers only" group lead by US Military engineer for packaging. The goal is to d
Electronics Forum | Fri Jul 16 15:21:26 EDT 2010 | davef
Duno. I'll shoot Daan an email.
Electronics Forum | Mon Jul 12 16:33:10 EDT 2010 | davef
Ideas to follow are: * Review IPC-7095 BGA Process Implementation * Look here: http://www.smtinfo.net/Db/_Ball%20Grid%20Arrays.html
Electronics Forum | Wed Jul 14 16:03:25 EDT 2010 | malcolmlanders
I seemed to have learned that on the bga chip that the soider is the soider balls on the chip. If this is true how do you get the chip to not move on the board when being inspected bdfore you soider it. and even in the transport of the board to the o
Electronics Forum | Wed Jul 14 16:10:07 EDT 2010 | malcolmlanders
I can't access these web pages do I have to log in somewhere
Electronics Forum | Wed Jul 14 16:59:52 EDT 2010 | swag
Solder paste on the pads will keep part aligned. If you do not use paste, you will need to apply tacky flux. You should not run without one or the other.
Electronics Forum | Thu Jul 15 12:09:10 EDT 2010 | wrongway
if the BGA has leaded balls use leaded paste if the BGA has lead free balls use lead free paste and set your oven profile to match the paste
Electronics Forum | Fri Jul 23 03:11:50 EDT 2010 | cobar
http://www.shanelo.co.za/SMD%20Assist.htm
Electronics Forum | Fri Mar 18 14:15:35 EDT 2011 | floydf
I found it over here: http://cache.freescale.com/files/archives/doc/app_note/AN1231.pdf?fsrch=1&sr=2
Electronics Forum | Fri Jul 09 20:39:31 EDT 2010 | malcolmlanders
I have never placed a bga chip before and need to know some o0f the basics of how to do it. I am really intrested in how the stencil will work with the soider and if there is a special soider that i need to use. I usually use a leaded soider from man
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