Electronics Forum | Wed Jun 23 10:33:02 EDT 1999 | David Reese
We are reflowing boards that have glop top components mounted on them. Do glop tops have the same moisture sensitivity as fine pitch? Should we be baking the boards prior to reflow?
Electronics Forum | Wed Jun 23 11:02:09 EDT 1999 | John Thorup
| | We are reflowing boards that have glop top components | mounted on them. Do glop tops have the same moisture | sensitivity as fine pitch? Should we be baking the boards | prior to reflow? | |If your glob tops are PBGAs, they are likely very mo
Electronics Forum | Mon Oct 18 05:31:38 EDT 1999 | Mattias
Does anyone have any experience of popcorning BGA�s in wavesoldering?
Electronics Forum | Wed Sep 27 09:36:46 EDT 2000 | Daniel Carlsson
Does anyone have knowledge concerning popcorning in wave-soldering. Is there a problem with moisture when the reflowed bords are left in air environment for days when manually assembled and then wave-soldered. Is there a certain temperature at which
Electronics Forum | Wed May 19 21:08:07 EDT 1999 | Omat Marasigan
hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... your help is greatly appreciated...thanks omat marasigan
Electronics Forum | Tue Sep 12 04:48:26 EDT 2000 | Daniel
Is there a risk of popcorning plastic components during wave soldering? (The PCB is first surface mounted, reflowed and washed. It is sometimes left in air environment for as long as 48 h before the throgh hole components are mounted and they are wa
Electronics Forum | Mon Sep 11 20:24:45 EDT 2000 | Dave F
Gary: Consider using the SMTnet archives to get started: * Popcorn* gives over 70 hits * Moisture sens* gives over 115 hits There is some wonderful background information in the archives that oftimes serves as an excellent starting point when invest
Electronics Forum | Mon Dec 30 13:52:50 EST 2002 | bcceng
Haran, This problem can also be caused if the BGA package is POPCORNING. Popcorning causes the BGA package to expand below the die, seen this happen so often to customers that try to install BGA's themselves without the proper handling of BGA's. Tha
Electronics Forum | Mon Oct 18 09:41:56 EDT 1999 | Wolfgang Busko
That should not happen. There are some threads concerning BGA and wavesoldering you could look for. It�s said that you should protect the vias in the BGA-area by soldermask or at least with tented vias to prevent rereflow of BGAs solderjoints what co
Electronics Forum | Tue Mar 27 01:52:23 EDT 2018 | buckcho
Hello Diego, are the components missing on the first side or the second side. Like Mr. Evtimov said, you can check before the oven the pcbs's visually and see what happens after the oven. In this way you can see if it is the oven for sure. Then there
