Electronics Forum | Tue May 26 16:59:47 EDT 1998 | Gary Simbulan
I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. Upon
Electronics Forum | Mon May 11 17:35:01 EDT 1998 | Steve Gregory
On 11 May, 1998 Todd wrote: | We are having continuous bridging problems with the trailing | leads on a 26-pin D-sub through-hole connector. The pitch is | 0.100". The connector is going through the wave at approximately | a 20 Degree angle. Does
Electronics Forum | Thu Jan 23 20:27:54 EST 2003 | joeherz
Hello, We recently installed a new/used UPK 650 fitted with a foam fluxer using an RMA flux chemistry. We have had problems with icicling and bridging from the beginning. The bridging occurs mostly on DIPs and connectors. The icicling is on longer
Electronics Forum | Mon Aug 09 20:47:21 EDT 2004 | KEN
I think OA flux left on the pot would quickly looses its activity and become part of the dross waste stream, and smoke stream for that matter. Also, if your wave is setup properly your selective pallets will scour (push) the top of the lambda wav
Electronics Forum | Mon May 23 10:53:32 EDT 2005 | HOSS
Eric, We also have a UPK 650C. Our machine was configured for N2 and using the ConTour nozzle. If you're using this nozzle without N2 you're creating tons of dross unnecessarily not to mention probably getting tons of icicling. We found out the h
Electronics Forum | Fri Nov 11 20:41:58 EST 2005 | GS
Thank you Davef, If I am not wrong in understanding, your answer is mainly related to the Legal point of view according to several different Countries who adopted Rohs or equivalent. My question, sorry for my poor English, is mainly related to the
Electronics Forum | Wed Nov 16 09:22:24 EST 2005 | chunks
These are all good questions. Dip fluxing is fine. Make sure you let all the remaining flux drip off the board. Letting it drip into the pot will cause a lot of spattering of hot solder � be careful. Dipping the board slowly into the pot should
Electronics Forum | Thu Dec 29 09:20:30 EST 2005 | Cmiller
We have tested SN100C and SAC305 in our selective solder machine (Ersa Versaflow). We wanted to test both alloys in the selective first because the investment in filling the pots is minimal. In our initial tests the SN100C alloy appears to be the bes
Electronics Forum | Fri Jun 09 11:55:34 EDT 2006 | jbrower
Howdy Amol, As far as I can see, there aren't too many pitfalls with SN100C. Just make sure to keep all of your alloys seperated. The issues that I am working out right now is the profiles with our wave pallets and some of our larger components. We
Electronics Forum | Tue Dec 26 22:18:20 EST 2006 | davef
Common methods to replate components are: * Barrel plating http://www.finishing.com/Library/zemo/barrel.html * Hot solder dipping - MIL-F-14072 M258 Certainly you can do this yourself by dipping the component leads into a solder pot containing lead