Electronics Forum: pre-bake bga (Page 1 of 1)

Pre-baking derating

Electronics Forum | Fri Jun 18 06:54:43 EDT 1999 | Paul McMichael

A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for popc

Re: Pre-baking derating

Electronics Forum | Fri Jun 18 13:30:01 EDT 1999 | John Thorup

A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po

BGA Rework affected by cold weather?

Electronics Forum | Fri Dec 05 10:09:36 EST 2014 | robl

Hi Rob, Could be moisture getting into the boards or the BGAs or it could be drafts messing with the thermocouples measuring the heat at board level meaning you over cook it. Are you pre-baking the PCBAs & the BGAs before reworking and replacing?

MSL Component - Popcorn Temp.

Electronics Forum | Wed Jul 04 09:58:50 EDT 2012 | daxman

Assuming that you have a saturated moisture-sensitive component: At what temperature would popcorning or internal component damage occur? I would guess that it would be at a temperature where water would boil, around 100 degrees? However, the JEDEC J

Re: Pre-baking derating

Electronics Forum | Fri Jun 18 10:59:37 EDT 1999 | Scott Cook

A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po

Re: Pre-baking derating

Electronics Forum | Fri Jun 18 12:11:20 EDT 1999 | John Thorup

A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po

BGA Baking in Reels?

Electronics Forum | Fri Feb 01 15:09:43 EST 2008 | chef

Don't do it.!!!! Are you nucking futs? Why is pre-bake required? Are you producing in high humidity? Is the package of the device poroues enough to suck in moisture? Think, consider you will not get an even "bake", the outside of the reel will get

BGA failure at Functional Test

Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70

Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f

Re: Plastic BGA

Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc

Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity

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