Electronics Forum | Thu Jul 13 04:01:02 EDT 2000 | JohnW
Dave, Firstly..how the heck are you?..been a while.... Ok so I'm running an Electrovert Electra witha hot gas knife, & I've got large server boards going over the wave. I've seen us loose chip, mainly Tants on the hot gas knife...ain't good especia
Electronics Forum | Wed Apr 12 20:41:31 EDT 2000 | Dave F
Russ: That�s a pretty stand-up postin� bud. It�s neat that you can root-out that dirt. We couldn�t dig-up that stuff, if they threatened to shoot the dog. You could be correct about using convex for waving. We don�t wave RNET as Philips suggests
Electronics Forum | Mon Feb 05 06:57:52 EST 2001 | PeteC
Dason, IPC/EIA J-STD-001C states: "....temperature within the range of 230C (446F) to 290C (554C)." That's a pretty wide process range. 250C has been typical in the past. We run ours from 230C to 240C. We have found that some single-sided PCBs can de
Electronics Forum | Fri Feb 16 02:00:12 EST 2001 | PeteC
Dreamsniper, The optimum contact (dwell) time in the wave should be 2 seconds. Contact band width is a function of conveyor speed. For an example, 5cm of contact band width at 150cm/min. conveyor speed will give you 2 seconds of contact time and 2cm
Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam
The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T
Electronics Forum | Thu Oct 26 13:56:08 EDT 2000 | ptvianc
Hello: Pre-baking laminates should only be performed:(1) to meet contractual agreements or (2) in response to an actual defect that can be traced to PWB water absortion. Besides the fact that a pre-bake is an enormous process "bottleneck," it also
Electronics Forum | Wed May 09 13:11:22 EDT 2001 | zam_bri
Hi.. Recently, I have received a few reels of 0402 with an old date code ( but still less than 2 years old).I don't have a capability in-house to carry out the solderability test except for the dipping test ( dip the components in the molten solder
Electronics Forum | Mon Jun 18 01:09:03 EDT 2001 | Dean Stadem
Igmar, If these parts are epoxied in place, and subsequently wave soldered, I would bet you a cup of coffee that they are cracking due to the thermal shock of the wave. Typically there is a valley or dip in the temperature after the pre-heat in the w
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
Electronics Forum | Thu Nov 11 14:13:57 EST 1999 | Dave F
Thomas: From what you're telling us, you seem to be thinking correctly: 1 Paste should not spread appreciably in preheat 2 Something has changed, because you've not had this problem, until recently Two things to consider: 1 Has any thing changed
