Electronics Forum | Tue Aug 28 08:28:30 EDT 2012 | rgduval
We agree with all of the previous comments, and would add the following: Warpage is generally caused by excess moisture in the raw boards. Have you tried baking the boards prior to assembly? We had this issue on a simple 4-layer board, and found t
Electronics Forum | Thu Nov 15 10:19:05 EST 2012 | davidmercader
Hi, We have problems with our wave soldering process. The problem is that during the same assembly, after wave soldering, some pcb’s look not clean and other pcb’s look good. We use lead free SAC305 solder and flammable flux. We think our proces
Electronics Forum | Mon Jul 08 13:10:55 EDT 2013 | rgduval
As with any issue like this, your miileage may vary with suggestions....but, here are the items I would consider: 1. Clinch tightness. I believe IPC gives a recommendation on the amount of bend in a clinched lead; make sure you're not beyond that.
Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew
I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag
Electronics Forum | Wed Sep 18 14:12:40 EDT 2013 | pjchonis
Hello Bachman. SAC305 is the most common lead-free solder alloy, not only for wave soldering but also selective. Most of our selective customers (especially automotive) are using SAC305. What is more important than the alloy to consider is the flux
Electronics Forum | Tue Nov 05 09:57:45 EST 2013 | cuperpeter
Hello All, We have a problem with dewetting of solder paste. Problem is most visible on the pads without components (see attached pictures) and occurs randomly, 20% of PCB's. Pcb supplier sent us a cross-section of pads with thickness of Cu, Ni and
Electronics Forum | Mon Nov 11 08:47:00 EST 2013 | mleber
Thanks guys. Here are more details. The cards are essentially the same. They use the same connectors, same footprint, the traces / layers would be comparable etc. The difference between the 2 we see is that one is laminate - Rigid Metal Clad Base, Ty
Electronics Forum | Sat Nov 23 12:39:18 EST 2013 | joeherz
We installed a Soltec Delta 3 a few months ago and have been trying to run with a VOC free no clean. We're using SN100C in the pot. We are spraying the material and have top/bottom preheat. Evaporation of the water in the flux is a bit of a stru
Electronics Forum | Wed Mar 11 17:32:46 EDT 2015 | jlawson
Small paste deposits have less flux thus less flux activity to enhance the wetting. So preheat needs to be as short as possible, ramp to spike if possible. Try not to ramp hold and spike - pending thermal delta on product can be made to ramp to spike
Electronics Forum | Sat Mar 28 06:59:03 EDT 2015 | robertwillis
I would agree with the comments so far its much better to have some pre heat. You have not explained why bottom side preheat is a problem. Even having some input will help balance the process. Assume there is some thing on the back side that is a pro
