Electronics Forum: print pressure (Page 16 of 31)

Re: paste release from stencil, and volume calculation

Electronics Forum | Tue Nov 09 17:12:38 EST 1999 | Dave F

Steve: Addressing your points: 1 FINE PITCH APERTURES Electropolishing Laser Cut Stencils: Laser cut should not requiring polishing. Geesh, how much money do you have for stencils? ;-) Oval Shaped Apertures: Pass. What do you expect to gain f

Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Tue Apr 20 14:25:05 EDT 1999 | Stephen Smith

I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following crit

Screen Printing

Electronics Forum | Tue May 02 05:59:28 EDT 2006 | davef

We agree with Ken's points about off contact / screen versus stencil, but this DHolt is talking stencil [regardless of what is typed about screens]. Comments are: * On "smears under the stencil": smearing happens. It makes us wonder about the frequ

Re: Which Paste

Electronics Forum | Fri Jun 05 07:21:17 EDT 1998 | Earl Moon

| I am currently reading as many articals as I can to familiaize myself with Surface Mount Technology. My company is planning to install a SM production line by the end of the year. | Here is one of my questions. | I have read that one of the specifi

defects in pcb manufacturing

Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef

Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated

Stencil Printing for MPM model # SPM

Electronics Forum | Sat Mar 17 15:12:33 EST 2001 | robhal

First thing to check is that you have a good gasket between the PCB and the stencil (if not check that the tactile is free of paste at the base of it and calibrate the tactile. I am assuming it is not a head mounted tactile) Also check that the wipe

TSOP40 Lead pitch 0.50mm recommended aperture sizes?

Electronics Forum | Thu Mar 06 10:57:28 EST 2003 | Mark

What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. And direction of squeegee print over the aperture? Recommended Stencil thickness? Recommended aperture reductions? Recommended pcb pad sizes? Recommended

Screen Printing for BGA

Electronics Forum | Thu Aug 21 18:36:32 EDT 2003 | paulm

Hi Dave and Justin, Thanks for the advice. Dave you mentioned you "smush" your bga's. What type of machine are you placing then with it? Is the additional pressure to smush them machine or manually applied? Also, the 0.004" variance we are being

printing solder paste on test vias

Electronics Forum | Fri Aug 22 09:41:49 EDT 2003 | davef

Mantis: Kenny reflows paste on [wave solders] all via, not just the test via, to plug the via and provide for a pressure seal between the board and the test fixture. Beyond that, since solder is softer than copper [and fills the hole better], solde

SOT 23 not reflowing

Electronics Forum | Tue Jan 13 19:41:43 EST 2004 | Tom B

Chris, 1. You may want to check lead finish (plating). 2. Is there shadowing? 3. Is Pik-n-Place providing enough pressure to slighlty push part into paste? 4. Is this a new product? or existing? If existing has suppliers for parts changed? 5. Is


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