Electronics Forum | Wed Feb 25 02:33:52 EST 1998 | Scott McKee
| | Stencil Opening | | Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable | Ron, | Use a six mil foil thickness for your stencil. Go one to one with yo
Electronics Forum | Wed Feb 25 16:39:29 EST 1998 | Eldon Sanders
I agree with Chrys, get the spike temp up and wetting is not a problem. However, when the palladium mixes in with the solder the joint will become more brittle. You need to make sure enough solder is printed on the board to minimize the concentrati
Electronics Forum | Tue Feb 24 01:19:01 EST 1998 | Jon Gruett
You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exa
Electronics Forum | Wed Jan 28 19:56:29 EST 1998 | Steve Gregory
Raymond, Have you ever heard of Band-Etch, or another term called Band-width Etch? It's a trademarked process of stencil etching from a company named BeamOn Technology, they're out here in "Silly-con" valley (408) 982-0161. They way they etch their
Electronics Forum | Thu Aug 09 12:36:26 EDT 2001 | Michael Parker
Adam- Mikie here. I too am placing 2 PBGA sockets on an assembly but they aren't mirror imaged. Thanks to the SMT Gods for that one. You say you added more paste to solve for open solder. Do you have x-ray? Were the alignments perfect? Also the part
Electronics Forum | Thu Aug 23 16:41:06 EDT 2001 | slthomas
Naw, the rest of the BOARD we use them on. Same assembly. Actually we use them on one other assembly and have the same problem. Same oven, same line, same paste, same problem. I've tried to get the production super. to move them to another line w
Electronics Forum | Wed Sep 05 08:22:48 EDT 2001 | davef
Jack Crawford, IPC Director of Assembly Standards and Technology says "IPC-7912 is used for end-item DPMO calculation; one gathering of DPMO data at the end of the entire assembly process. IPC-9261 will be used throughout the manufacturing process so
Electronics Forum | Mon Sep 03 03:32:47 EDT 2001 | johnw
Franky, what method are you using for printing glue? metal stencil or plastic?, and is it on contact or off contact ? and what type of squeegee's are you using? basically give us more infomation. In term's of measuring height / volume, you can do t
Electronics Forum | Thu Sep 13 17:57:59 EDT 2001 | davef
You're correct. It is curious. Possible angles to look at are: 1 WS609 loves moisture in the air. In high humidity shops, this paste hakes-on liquid. If this is the case, you should also see slumping, resulting in fine pitch bridging, and solder
Electronics Forum | Tue Oct 09 20:27:13 EDT 2001 | davef
That�s a 672 BALL BGA, bud!!! It�s a BIG Mutha!!! [I know. I know. For some reason suppliers call balls "pins".] Let�s focus on: * Clarifying the units on your PCB and aluminum plate thickness measurements. * Describing your use of the aluminum pl
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