Electronics Forum | Wed May 16 01:06:38 EDT 2012 | bwjm
Hi Before I say anything I ll qualify who I am. I > work for a AOI/SPI manuafacturer > > Automatic > printer is your best option for small > runs. Print process is responsible for a vast > number of solder defects and improving here is > your b
Electronics Forum | Sun May 27 19:51:00 EDT 2012 | darby
Seeing as you say you only have a small amount of cash ... I'd also consider a semi-auto printer where you align a golden board, set up the two cameras by boxing or overlaying a pad etc, and then use the vernier adjustment to get each pcb to align wi
Electronics Forum | Fri Jun 01 11:06:17 EDT 2012 | davef
Post-reflow delamination is almost always caused by entrapped moisture. Here's more from the fine SMTnet Archives ... http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=64774 As Graham Cooper suggests in an earlier posting on this thread, ba
Electronics Forum | Fri Jun 29 10:56:56 EDT 2012 | jorge_quijano
Hi guys, I need your advise on this, I have a very uncommon PCB design (at least for me, I've never seen anything like this...) it is 32" x 18" x 0.062" and has 9 QFNs that are driving me crazy, I'm not able to get a good alignment, I can get a mediu
Electronics Forum | Mon Aug 06 14:08:56 EDT 2012 | dyoungquist
We run a MY12 and our largest layout has 9700 components of which about 8500 (88%) are placed by the Hydra head. Average run time for our layout is 75 minutes. Based on that and depending on what percentage of your components are Hydra mountable, y
Electronics Forum | Mon Aug 13 12:38:38 EDT 2012 | grahamcooper22
Maybe the area ratio between the sides of the stencil apertures and the aperture opening is too low for the spec of the paste ? So it will tend to stick in the apertures. ...only solution is thinner stencil or a paste that can release easily when are
Electronics Forum | Fri Nov 23 06:34:43 EST 2012 | bandjwet
With all of the various techniques available for LGA rework including but not limited to: Bumping the part using a polyimide stencil http://www.solder.net/products/stencilmate Bumping the part using a metal fixture or http://www.finetech.de/advance
Electronics Forum | Fri Mar 29 16:57:07 EDT 2013 | aemery
Gentlemen, Just became a member and scanning the old posts hoping to help people out with their MPM printers. Most of this info is correct, the last post was the best. Offsets on an Accuflex printer can be put in either per process program or glob
Electronics Forum | Fri Feb 01 19:07:57 EST 2013 | hegemon
We have had some success in void reduction with LGA by pre-tinning or "bumping" the devices before placement. The extra solder seems to allow a slightly higher standoff, and allows better outgassing, is my guess. A lot more labor , but the results
Electronics Forum | Thu Feb 14 17:36:28 EST 2013 | dontfeedphils
I'm trying to get an '07 Accuflex into production and I seem to have a small problem. When trying to calibrate the zero pressure point on the squeegees I drive them down until they are touching the stencil and once they touch the stencil they run ou
