Electronics Forum | Wed Apr 21 17:11:05 EDT 1999 | Earl Moon
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Wed Apr 21 19:09:10 EDT 1999 | Earl Moon
| | Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proc
Electronics Forum | Wed Apr 21 12:01:22 EDT 1999 | jseagle
| To all who will be potentially my salvation, | | I am currently researching Polyimide stencils for possible use and manufacture. If I may be indulged - with due reference to all past enquiries and notes on the subject - can anyone offer an up to d
Electronics Forum | Tue Apr 20 14:25:05 EDT 1999 | Stephen Smith
I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following crit
Electronics Forum | Mon Apr 19 17:44:43 EDT 1999 | Chrys Shea
| | While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | | I thought I'd ask some experts. Any help guys? | | | Gerry: I imagine there co
Electronics Forum | Tue Apr 13 09:11:54 EDT 1999 | Dave F
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Fri Apr 16 11:07:53 EDT 1999 | Vic Lau
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
Electronics Forum | Tue Mar 30 16:51:17 EST 1999 | Chris Lampron
| We've been using a newly installed DI re-circulating system. | It's been a big headache. Mostly understanding what causes our resistivity to be unpredictable. I think I've got a handle on that part now. The system consists of a Carbon,HMR(chealet),
Electronics Forum | Thu Apr 01 16:47:23 EST 1999 | AlexO
Dan, The rationale to use laser cut stencils in my experience is based on the benefits to paste release. Laser cut stencils are "supposed" to have a smoother inner aperture wall. That, combined with the trapezoidal shape (which can be emulated with
Electronics Forum | Thu Apr 01 22:21:45 EST 1999 | Dave F
| We make an excellent chem-etch stencil. Our customers have had success printing 16 mil pitch without a problem. This is not an advertisement! | | When we try to sell our product to new customers, we find more and more people willing to pay more fo
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