Electronics Forum: problem (Page 1221 of 1307)

Ok gurus got a question?

Electronics Forum | Wed Nov 29 22:16:54 EST 2006 | fishingfool

Have something that should be standard but never is. Cycle time. Long story short. Customer buys system. 8 months later customer says system isn't working as should. Go onsite and find customers application is causing huge maintenance problems. Sol

Inline Aqueous Wash for WS and RMA fluxes

Electronics Forum | Fri Dec 08 02:40:45 EST 2006 | Mike Konrad

Hi 'K', We manufacture both batch and inline defluxing equipment so we have no axe to grind with either technology. There are pros and cons associated with both technologies under specific conditions. Batch machines are typically good cleaners but

maintain glue size

Electronics Forum | Tue Dec 19 20:54:52 EST 2006 | Guest

Your experience is quite different than mine. At continues dispensing,I noticed that glue dispense volume increase as the material in the syringe decrease. My machine is using air time pressure pump. This is normal for this kind of pump since ai

Marking on shrink tubing

Electronics Forum | Wed Jan 03 19:12:09 EST 2007 | Mike F

If I could set it up for markers and leave it I probably would not be as frustrated with the printer. We also run polyimide labels through that same printer, which means you have to adjust that sensor to a different position. Then when we switch back

Yield on 0402 SMT Printed Circuit Board Assemblies

Electronics Forum | Mon Jan 08 03:47:47 EST 2007 | tk380514

as someone had said before, check you stencil and have it redesigned. I design our stencils for my factory and have inproved quality in BGA , QFP and 0603 case sizes. we did have 1 prototype series that used 0403 chips btu we had brand new feeders an

BGA adapter boad?

Electronics Forum | Fri Jan 05 10:15:55 EST 2007 | Cmiller

I have a customer working on a new design of a rather large board that needs to use a micro BGA that will require 8 layers. He needs to use that BGA and it does not come in any other package. He asked me about making the BGA an adapter or daughter bo

Lead free rework of BGA

Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff

Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo

PbF PCB finish

Electronics Forum | Wed Jan 24 11:27:54 EST 2007 | bradlanger

We have been using SN100C lead free hasl for over a year now with good success. It is very solderable and has good shelf life. You do have to make sure the finish gets applied to the correct thickness. If the lead free hasl finish is not applied thic

CP4 Placement/Pickup Height

Electronics Forum | Thu Feb 01 20:17:56 EST 2007 | daxman

I was doing a PM on our CP4-2 and decided to check the placement height of every nozzle. (we're seeing some skewed components and a lot of dropout under stn. 1) I put a dial guage under the nozzle tip at stn 7, turned placing sol on, and checked ev

Low Melt Solder Chemistry for use in Rework Process

Electronics Forum | Wed Feb 07 13:44:09 EST 2007 | dsoohoo

After some precursory experimentation, I am planing on employing a form of low melting temp solder for use in reworking some very dense, copper core PCB's, both SMT and THT, which were originally mounted with 63/37 solder. The main problem with the


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