Electronics Forum | Wed Oct 04 11:36:06 EDT 2006 | flipit
Hi, Anyone ever have an issue with stray capacitance when using no clean solder paste. We are having a timing problem on one product. The problem goes away when we clean the assemblies. We use a no clean process normally. These assemblies worked
Electronics Forum | Sun Oct 29 22:41:29 EST 2006 | hanocete
We have a current problem on our packages after we bake it for 24 hrs prior BGA rework. Flux or white residues found on the connector leads and terminals that cause not contact problems during mating. Could you help us how to clean the fluxes properl
Electronics Forum | Mon Oct 30 09:24:21 EST 2006 | ronalds
I have some problems in sufficient preheating the pcb's. They splatter on the mainwave, causing solderballing. Less flux causes problems with the fill of the through- holes. We use a Delta Wave with 3 preheat zones, the first two are calrods the thi
Electronics Forum | Thu Dec 07 21:08:48 EST 2006 | Cmiller
it is not that I am aware of either. Make sure you get your boards from a house that does the gold plating in-house or you will continue to have the problem. The gold needs to be plated immediatly after the nickel, not a few days later. I have only h
Electronics Forum | Fri Dec 15 05:02:22 EST 2006 | Harsha
Thanks for the response. I am using mainly two brands of ovens. One is Heller and the other is a chinese brand called Fulongwin (copy of Vitronics). I see the problem in both, more severe in the Fulongwin. Both are 8 zones and a few 9 zone Hellers. I
Electronics Forum | Tue Dec 19 01:57:52 EST 2006 | hemu_me
we have fuji's cp-iv-3 machine made in 1993.we are facing problem everytime when we change the jobs(for example we change from pcbA to pcbB to pcbA)even though program is same. There are some mechanical adjustments like conveyor adjusted according to
Electronics Forum | Tue Dec 19 03:46:24 EST 2006 | en
I facing problem when running glue process. the glue size cannot maintain with the same size when the glue in syrince reduce. it become smaller, smaller and smaller compare to the time. Beside, when there have any changing model, the machine stop for
Electronics Forum | Tue Jan 09 22:33:45 EST 2007 | Guest
Dear AJ, Try removing shield ,test it, verify if it would perform as the previous runs . If not, there maybe something wrong with device or as one of our collegue mentioned that there is possibilty the your customer change some components.If the
Electronics Forum | Fri Jan 19 13:31:14 EST 2007 | lit51
Is the failure just out of tolerance or is it non functioning? For tolerance problem, compare the x-rays of the good and bad units. It will take a very high resolution x-ray to spot the differences. Changes in capacitance values can occur based on
Electronics Forum | Wed May 02 11:00:46 EDT 2007 | bartlozie
to get a 0-defect layout, OEM and CM have to work together, If you know what connections (balls) are the problem ones, let me know, and send me the gerber-layers + solderpaste layer, so we can see if the problem is design related or if you CM realy
