Electronics Forum | Tue Oct 05 10:13:48 EDT 1999 | Frank Fossett
I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer wants to use an .035 pad with a .012 dia. hole, there are no via's under the zero clea
Electronics Forum | Wed Sep 29 14:45:11 EDT 1999 | Earl Moon
| Hello all, | | There was a problem with the web email system, and it has not been distributing emails properly since Sept 25. It is now fixed, and the awaiting emails have been distributed. | | Sorry for the inconvenience, | Cliff | Cliff, Tha
Electronics Forum | Wed Sep 29 04:30:27 EDT 1999 | ROBERT
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Fri Sep 17 15:20:52 EDT 1999 | Earl Moon
| HI everyone, | | We are using a Siemens ap-25 screen printer, in the past we have not had any problems with adhesive placement until a couple of weeks ago. It seems the x axis has decided that it should be set somewhere between .00085 and .001
Electronics Forum | Fri Sep 17 18:33:51 EDT 1999 | Michael
| One problem we found was that when more than one person was working on the system at one time we had problems. For example one person working on the line computer, another on the machine computer and another on the VMPS system. That was usually a
Electronics Forum | Mon Sep 13 11:23:41 EDT 1999 | Bing Feng
Hi, Recently encountered missing components problem at the SMT process. Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked the pick
Electronics Forum | Fri Sep 03 14:20:38 EDT 1999 | David
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | You must have been in the same meeting I was in earlier today. We are currently having some opens on BGAs. The problem joints are all on the perimeter of
Electronics Forum | Tue Sep 07 12:45:47 EDT 1999 | Brad Kendall
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you having a problem with the joint openning up after reflow. Like it was soldered after the reflow process, but at final test is not? I had this pr
Electronics Forum | Tue Aug 24 16:11:21 EDT 1999 | Scott Cook
| Hello everyone, | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | | Gyve
Electronics Forum | Mon Aug 16 00:05:52 EDT 1999 | Will Grubb
Hello I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce whi
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