Electronics Forum: problem (Page 326 of 1307)

Re: Problem with a IP2 Machine Interface of FujiCam

Electronics Forum | Thu Nov 09 22:23:17 EST 2000 | Al Lugo

Hi What you really need to do is call the software department at Fujiamerica (847.821.2401). They will review your process and get you back on track.

Re: Problem with a IP2 Machine Interface of FujiCam

Electronics Forum | Fri Nov 10 10:39:43 EST 2000 | omar_verdugo

Hello Eva. I was using Fujicam 1.1 and i had a problem with the theta is in the shape library for example all the drawings are on 0 degress like a in the part data and all that work fine with the anothers machines like a cp6, but when i use a ip2 i m

Re: Problem with a IP2 Machine Interface of FujiCam

Electronics Forum | Fri Nov 10 10:51:23 EST 2000 | Al Lugo

Hi Please call Fuji, I beleive that they can still help you.

Re: BGA problem: open after reflow

Electronics Forum | Thu Nov 02 22:11:46 EST 2000 | Dason C

Please check with Fab house, what is the thickness of the immersion gold if the gold thicknesss is less than say 2.5 micron, you will found dewetting or open. It is recommend the gold thickness is around 5 micron. Good Luck Dason

Re: BGA problem: open after reflow

Electronics Forum | Mon Nov 06 21:06:13 EST 2000 | Dave F

Thomas: Wheeee, a 40% failure rate. Now, that make your boss chase you around the room won�t it? As you indicated, x-ray won�t do dip about helping to identifying problems [or ball cracks either]. Consider using an ERSA scope [er whatever they ca

Re: BGA problem: open after reflow

Electronics Forum | Sun Jan 21 16:42:35 EST 2001 | davef

I just can not get over the size of these crystals. What is the chronology of and the span of the thermal cycles this BGA has seen.[Just guess at the fabrication cycles, if it's difficult to determine]

Solder Stack Film Capacitors

Electronics Forum | Fri Oct 27 13:49:11 EDT 2000 | dpoling

We are currently having problems with tombstoning and minor lifting on small SMT stasck film capacitors. Does anyone have any ideas?

Re: Wave Soldering 0.050 pitch connector

Electronics Forum | Sat Oct 28 10:24:56 EDT 2000 | Ben

Try to insert thin copper plate (approx. 1.5mm thk) at the end of the flow direction. Place it approx. 2mm away from the lead. The copper will pull away the solder & thus minimise bridging problem.

Re: Wavesoldering

Electronics Forum | Tue Oct 24 19:59:12 EDT 2000 | Dave F

John makes good points that are in line with those made [in the SMTnet Archives] when trying to solve solder side bridging problems in SOIC and such.

Re: cleaning solution to clean socket board.

Electronics Forum | Mon Oct 16 20:50:34 EDT 2000 | Dave F

This is vague. What is causing ... When does it appear ... What is it's occurance ... What is the frquency ... What does it look ... What problems does it ... And on and ...


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