Electronics Forum | Wed Feb 26 14:37:57 EST 2003 | russ
Never used U shapes for 0603 but have used them for MELF pkg. Never had a problem printing as long as area ratio is acceptable. So just out of curiosity, why U shape for 0603? Russ
Electronics Forum | Fri Feb 28 12:08:07 EST 2003 | davef
Paul We don't like to mix metals on press fits. Yano, we do gold on gold or solder on solder, but we don't mix metals [except with imm silver / tin] to avoid electrochemical corrosion. Is that bad information or does AMP think that's not a problem
Electronics Forum | Sat Mar 15 00:52:18 EST 2003 | Grant
Hi, We had tomb-stoning on a product, and it was quite severe. We eliminated it by reducing the amount of solder paste on the small passible component pads. We used a 5 thou stencil, with 20% reduction, and it eliminated the problem. Regards, Gra
Electronics Forum | Tue Mar 18 07:53:39 EST 2003 | Paul Staniford
I am looking at dispensing solder paste using a Fuji GLV glue dispenser. This is to enable us to produce prototype pcb's without the need to purchase a stencil. Has anybody tried this before? If so what problems should I expect to encounter.
Electronics Forum | Thu Mar 20 15:14:48 EST 2003 | swagner
Does anyone out there have any experience printing with the new synthetic pastes? The problem I am experiencing is flux migration under the screen that I do not see with my other suppliers, any help would be appreciated. Thanks,
Electronics Forum | Mon Mar 24 12:15:24 EST 2003 | zaxx007
Hi Kevin, Hepco makes a small unit called a Hepco 3000-2, with the right die set this should be no problem. The unit should retail for around $600.00USD, have a good day. Sincerely, Zack Schmad factory-automation@cox.net
Electronics Forum | Tue Mar 25 21:57:27 EST 2003 | Dreamsniper
We are in the process of deciding which stencil printer will we acquire for our line and would like to identify which will provide us more benefit when it comes to enclosed print head. Can anyone give me some comparisons and problems or troubles that
Electronics Forum | Thu Mar 27 11:11:00 EST 2003 | blnorman
We've evaluated the Rheopump. Problems we've found are 1) cycle time differences between forward and backward print (evidently the pump charges pressure on one and not the other), 2) excessive amounts of paste left in the tubes (roughly 60 grams we
Electronics Forum | Sun Mar 30 21:20:48 EST 2003 | Dreamsniper
Yes, I come from a land down under...currently participating in an unnecessary war in IRAQ! But what about paste replenishment on both heads? Wastage? Damage to stencil problems if any? Maintenance? etc... thanks for all your info but I think I nee
Electronics Forum | Tue Apr 01 19:21:25 EST 2003 | Myu
I'm a user changing over from WS-609 to WS-709. WS-709 has less voiding problem and longer stencil life than WS-609. Ws-709 has a less foaming during washing process. Thanks, Myu
