Electronics Forum: problem (Page 521 of 1307)

No-clean solder paste

Electronics Forum | Thu Mar 22 14:12:09 EST 2001 | slthomas

Interesting...the very reason we use water soluble paste on some of our boards is for that reason, although I've never been able to get anyone to show me something in print that supports it. It's just what engineering has told me. We currently have

No-clean solder paste

Electronics Forum | Thu Mar 22 16:35:06 EST 2001 | Steve

Deja vu! When I read your response I turned around to see if you standing behind me listening to our problem. We currently make about 50 different boards all using no-clean that have no problems, yet this newest boards has a couple of issues that eng

Researching stencil cleaners

Electronics Forum | Thu Mar 29 18:14:19 EST 2001 | kerryn

Hi Dave, I looked into the South Coast Air Quality Management District Clean Air Solvent Certification when I was having my problems with VOCs. The problem with the SCAQMD CAS Certification is that it only certifies chemicals as they are found in t

Wavesoldering

Electronics Forum | Thu Apr 05 22:24:32 EDT 2001 | davef

I think your solder mask is a partial cause of your solder balling. Additionally, adjusting some machine set-up parameters may also help. 1 If we were talking about a single assembly problem, we�d be thinking about the laminate, but since you say t

BGA CORNER WARP

Electronics Forum | Thu Apr 26 16:52:53 EDT 2001 | fmonette

Robert, Someone already mentioned the popcorning phenomena. This would show up as a dome-shaped deformation underneath the component, due to internal delamination around the die area. However what you describe sounds like another moisture-related

FUJI CP743 anyone???

Electronics Forum | Fri Apr 27 13:41:19 EDT 2001 | 061032

The "band wagon" was a corporate decision. The performance issue concerned a communications problem between the line computer and the F5 (f5 locked up in the middle of a PCB). This issue did not show it's ugly head until a month after install. I t

Skewed components

Electronics Forum | Tue Apr 24 21:12:32 EDT 2001 | davef

I prefer mine skewered with a remoulade, yum. IPC-A-610 allows component side overhang to the lesser of either up to 25% of the component termination width or up to 25% of the width of the pad for Class 3 devices. Help us understand your problem.

Re: Cost effectiveness

Electronics Forum | Tue Nov 28 12:22:21 EST 2000 | rabell

Garth, the short term solution to your problem from our perspective is to rent the suite, train your people, and send it back. This can fit anyone's budget. We try not to have price stand in the way when the training is required. The only danger yo

Re: Resistor Paks on solder side of board

Electronics Forum | Thu Jul 20 13:57:04 EDT 2000 | Boca

I am not answering for Techguy2000, but I am chiming in here, I have the same problem. Our resistor packs are ceramic body with no leads, they have a metalized area reminicent of the old castelation leads of year gone by. The lead pitch is 50 mil

Loctite Adhesive Viscosity

Electronics Forum | Tue May 15 10:02:20 EDT 2001 | John

I should have been more clear;the temperature that I indicated was measured inside the dispenser cabinet. We setup a very simple system to monitor and maintain the temperature inside the cabinet. By comparing our temperature to our production resul


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