Electronics Forum | Fri Jan 27 13:01:15 EST 2023 | hta1979
Hi ! The graph of the second head is fine. The graph of the first head shows that the head needs to be cleaned, which is why it detects a nozzle.
Electronics Forum | Fri Sep 13 10:59:35 EDT 2002 | Simon Davis
Hi Folks, This is a totally speculative, if not cheeky post. I know very little about electronics, but I think you guys do. I have a problem with my car radio, that I'd really like to solve, as I cannot buy a new one where I live (Brazil), and I th
Electronics Forum | Thu Jun 24 10:11:33 EDT 1999 | Dave F
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Thu Jun 24 16:19:46 EDT 1999 | Kennyv
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Thu Jun 24 16:23:18 EDT 1999 | Kennyv
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Fri Aug 07 09:53:12 EDT 2009 | kpm135
The Z-axis Drive card on our MPM UP2000 HiE fried. We replaced it with a new card, setting all the jumpers to match the old card. After that we had to recalibrate the Z-axis and the snugger height but the problem is that the camera is now too close t
Electronics Forum | Thu Aug 20 08:23:23 EDT 2009 | ratsalad
One diagnostic tool that I have found useful in the past is the "hot plate test". Place suspect components and/or PCB's on a hot plate and turn it on High. Then observe. Granted the conditions on the hot plate are not the same as in a reflow oven,
Electronics Forum | Mon Nov 12 19:02:48 EST 2012 | jmartens1978
My first attempt was similiar to that. It was a straight ground trace running past the circular pads that were recieving the shocks. It was hit and miss when the arcs would occur. When I cut notches in the trace so the ground line had a point next to
Electronics Forum | Tue Jan 24 13:02:55 EST 2023 | elpos
Hello everyone ! I would like to ask for some help regarding the component aligner on the Samsung CP20CV machine (I just bought the machine and I am still learning to use it). I noticed that sometimes when I instruct the Head1 to pick up (any) nozz
Electronics Forum | Fri Sep 07 08:57:28 EDT 2001 | Hussman
Por, You talking wave solder or reflow solder? At wave, nitrogen is the way to go. Just like you stated, it does affect the surface tension. If you're reflowing, I wouldn't go nitrogen unless you have to. Improper stencil design is usually the c
