Electronics Forum | Fri Jul 25 23:01:04 EDT 2008 | chip_flip
What paste are using? You should referance the manufactures time and temperature specification. Running lead-free in a 5 zone oven can be done with out a problem but it is not production friendly. If you are concerned with through put I would look fo
Electronics Forum | Thu Jul 31 03:20:29 EDT 2008 | miroyu
Hi everyone I have Quad 4C with following problem. When I run machine "cold start" first power up it will run and initialize but after if I turn it off and back on it will NOT initialize. Z axis will push nozzle down and it will remain i that posit
Electronics Forum | Thu Jul 31 07:28:04 EDT 2008 | leemeyer
This sounds like a Quadalign problem. Upon startup the Quadalign system checks runout of the Z-rod and tries to find the tip of the nozzle. It will keep lowering the Z-rod and looking for the tip until it hits it's limit. Check and see if the Quadali
Electronics Forum | Thu Jul 31 10:37:25 EDT 2008 | 18424
I agree with RLM. What i have seen is that quad had a problem with the gounding system of the quad align unit. An additional ground wire was added at the quad align cage,and to the PCB located inside the front right access panel. I don't have a machi
Electronics Forum | Thu Aug 07 10:02:39 EDT 2008 | rgduval
Is this part placed on first-side processing? Is this defect being detected after second-side processing? We've had this happen before when running the second side of the board, parts being pulled, apparently, by the belt in the oven while being re
Electronics Forum | Mon Aug 11 15:44:41 EDT 2008 | stimpk
Although its a fairly rough image to look at I'd think you more of a reflow or paste issue. Looking at the two resistors, they don't look so good either. Although they maintained their placement alignment the solder does'nt appear to have flowed cor
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Fri Aug 22 10:01:52 EDT 2008 | robinj
I have seen this problem before. If the color is yellow usually it is caused by moisture left on the boards from poor drying after immersion silver. One of the ways to get rid of this is by dipping in acid cleaner solution. If the board supplier uses
Electronics Forum | Mon Aug 25 06:43:37 EDT 2008 | callckq
Dear All, Recently, we found a strange defect called "Head-in-pillow" defect at CPU socket BGA. The strange thing here is that this problem only appear on that CPU socket BGA and not on the others BGA which were also mounted on the PCB. We suspect
Electronics Forum | Tue Aug 26 09:33:04 EDT 2008 | wavemasterlarry
If this board is waved soldered than you may want to look at the wave causing the BGA to reflow a 2nd time when it goes over the wave. The board bows down and the the joint liquidfies and then hardens before the board fully goes back to flat which c
