Electronics Forum | Tue Mar 31 15:14:53 EDT 2009 | kpm135
Is your machine an inline system with the conveyors along the back? If so I have run into this problem before with the sensors on the covers for the conveyors. They are 'magnetic' safety switches that can appear to be closed but don't actually switch
Electronics Forum | Wed Apr 22 14:34:13 EDT 2009 | Quijano
Just to add a comment, we were using AIM Lead Free (SAC 305/ NC254 & 257) in the past and we had Voiding problems, then we tried Indium 8.9 HF, and we have better results, so now we are evaluating change to Indium for many of our products.
Electronics Forum | Wed Apr 08 04:29:14 EDT 2009 | kircchoffs
Hi Rodrigo, is your problem occurs only at 2nd device table? how about if you transfer the feeders to the 1st device table? if it happens at both device pls your part data if there's a value at pick-up. you can also check the proper data of the de
Electronics Forum | Tue Apr 28 03:05:48 EDT 2009 | nibirta
Hi, we are facing a problem with a cobar solder paste and i need some support here. We have 2 lots of solder paste: one makes solder balls, one no-solder balls. Can you suggest me any analyses that we can performed in order to see the differences bet
Electronics Forum | Thu Apr 30 12:50:07 EDT 2009 | realchunks
Could be board support. Breakaway boards are a little more flimzy than boards without. A bowed board will cause miss placements - again can be overcome with proper supports (depending on the machine) I would bet that the boards with breakaways h
Electronics Forum | Mon May 04 14:31:19 EDT 2009 | markgray
I am trying to figure out a strange problem on our machine. When I turn on the component verifier fuction the pick in the feeder offsets to the right 3-4mils. This is causing mispicks on 0805 and 0603 parts. When I turn off the verifier the pick is c
Electronics Forum | Wed May 06 17:41:07 EDT 2009 | wbaldwin
We seem to get "internal Error" crashes everytime we change programs on the series 3 Agilent SJ-50 AOI machines, as well as random crashes during inspection. Was just wondering if any other users out there are experiencing the same things, and if th
Electronics Forum | Tue May 19 15:06:36 EDT 2009 | c111
we had many problems with this. there is no standard that I could ever find. we came up with our own after weeks of headaches. we use 25% as our guide line we use window pain only for the center paid to allow for out gassing and reduce 15-20% globaly
Electronics Forum | Sun May 24 21:12:59 EDT 2009 | keith78
I have a problem recently to qualify QFN package on solder joint reliability. The pcb thickness stated in IPC-9701 is 2.35mm but from the in-house test, QFN surface mount on 2.35mm thickness PCB board have a short cycle to failure due to higher CTE m
Electronics Forum | Thu Jun 04 20:06:30 EDT 2009 | davef
Since posting the above comment extolling the virtues of NSMD pads and disparaging SMD pads, we've learned that the points apply to all array devices, but in spite of that some designers of fine pitch [eg, 0.4, 0.5mm pitch] array devices choose SMD w
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