Electronics Forum | Tue Aug 25 12:50:24 EDT 1998 | Lance Smalley
To see if the MV will recognize the marks, in the binary mode, when setting threshold (binary level), raise up the level until the edge of the mark starts to degrade. Write down the number. Lower the level until the fiducial starts to "bloom". Wri
Electronics Forum | Wed Aug 12 14:39:09 EDT 1998 | Mike C
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Mon Aug 10 11:28:19 EDT 1998 | Justin Medernach
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
Electronics Forum | Thu Aug 06 13:18:30 EDT 1998 | Bob Willis
| | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not e
Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach
| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the
Electronics Forum | Wed Aug 05 07:46:46 EDT 1998 | Earl Moon
| We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several
Electronics Forum | Mon Jul 27 21:10:10 EDT 1998 | D.Lange
| Hi, | Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subj
Electronics Forum | Mon Jul 27 23:20:14 EDT 1998 | Vincent Robert
| | I am considering of Philips FCM for the next production. | | But I have heard a rumour saying this machine is not capable for checking the lead polarity due to the laser scan system. | | i.e. SOT might be populated in wrong direction. | | Can som
Electronics Forum | Wed Jul 15 10:37:58 EDT 1998 | Ben Salisbury
| | We just have a use cp4 .I have a problem on transfering data between cp3 to cp4 .when I use the data for cp4 I can't have parts in correct location. Is that normal? or it's because that has a different vision system.if so.how can i do with it.the
Electronics Forum | Mon Jul 06 17:42:49 EDT 1998 | Bruce Houghton
| I'm having a problem getting good reflow on gold sufaced boards. The profile looks good and I have adjusted it both hotter and colder and adjusted the various times ( soak, reflow ) to no avail. What realy gets me Is that a month ago we built some
