Electronics Forum: problem (Page 961 of 1307)

Placement Program Tweaking

Electronics Forum | Mon Oct 15 16:56:18 EDT 2001 | davef

First, I�d like to kiss-up to the people that are likely to be responding to this question. Thank you for contributing to my recent query about placement program control. OK. Let�s talk about �good practices� in placement programming. Throw in an

Placement Program Tweaking

Electronics Forum | Tue Oct 16 03:15:00 EDT 2001 | Michael Trybula

At my previous job I inherited several lines where tweaking of a few components was allowed. The first thing I did was stop that practice. The problem with tweaking a program is that you are fixing the symptom and not the root cause. When the root

Fine Pitch QFP Bowing after reflow

Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette

Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p

IC Contamination

Electronics Forum | Mon Oct 22 17:37:51 EDT 2001 | davef

I�m aware of no such standard. There may be something in Euroland [ie, IEC, etc.] TM-650 �Test Methods Manual� has procedures for measuring various types of contamination, such as: * 2.2.25 �Detection Of Ionizable Surface Contaminants� * 2.2.27 �Cl

Solder Mask Specification

Electronics Forum | Wed Oct 24 14:06:37 EDT 2001 | mparker

If you let your design team leave things up to chance, chances are something will go wrong. You are right to want to take control rather than be lead down an undesirable path by the fab house. Various masks serve certain desirable purposes. You need

Flat Solderable Tin as a PWB solderable surface finish

Electronics Forum | Mon Nov 19 20:15:39 EST 2001 | davef

Now, that is one thickass board!!! The rant first: If our �board supplier changed our board surface finish on� anything without our approval, the board supplier would be an �X�. Life has enough surprises. And of all the flat finishes available, h

Non-wettig on chip cap.

Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny

Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta

Water Residue Stains - how to remove?

Electronics Forum | Wed Dec 19 01:17:13 EST 2001 | ianchan

Hi Experts, I need help here, advice appreciated from all... Production is running a Lot of flex-circuit PCB, through the SMT line, with 0402 components. The flex-PCB is taped to FR4 support "pallets" when processing thru' the SMT P&P m/c. We use

Programing

Electronics Forum | Wed Dec 26 14:19:52 EST 2001 | Stefan

I find that software is a quite individual part of the entire machine. Some programmers love to have at least 20 windows open at one time and others prefer to put all information on one single page. What appears to be easy for one, may be difficult f

BGA Straight crack

Electronics Forum | Tue Feb 26 10:55:58 EST 2002 | davef

This could be an electroless nickel / immersion gold specification. While the symmetry of the numbers is pleasing to the eye, but as Joyce Marchand says, "It doesn't blow-up my skirts." Problems with your specification are: * Lower end of the gold


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