Electronics Forum | Thu Dec 18 14:44:59 EST 1997 | Scott Cook
No problem..... > No; the last time I used the process was 1983. > Yes, and in your neck of the world, I'd bet you're looking at Flutec products.....(I used PP11 juice way back in 1979). > I would dispute this. I did EXTENSIVE testing for thermal eff
Electronics Forum | Tue Oct 09 12:30:26 EDT 2001 | mparker
Cal - even trolls were smart enough to outwit most back in the day. I appreciate your input as well as Dave's. I agree about doing the retest. I just didn't have the right info, just some gut feel that made me question the purported lab results. I h
Electronics Forum | Tue Oct 30 21:42:32 EST 2001 | surachai
I have question about board baking after in line washing machine then I would like to know some information that ; 1) Do we need board baking after in line washing machine? Both bare board and assembly borad normally we don't bake . 2)In case of ne
Electronics Forum | Thu Feb 28 18:23:39 EST 2002 | davef
No, not as such. Nor should there be. This is not to say that the issue of making good prints is anything but absolutely vital to cost effective operations. Experts attribute 60+% of SMT soldering defects to the printing process. Properly, both J
Electronics Forum | Mon Apr 22 23:51:06 EDT 2002 | mkkrishnakumar
Dear sir, I am a regular viewer of smtnet.com and now one of my customer have the process problem that is they are having double sided smd's and pth too. hence we have suggested them to do the following processes First do the smd soldering by ste
Electronics Forum | Wed Jul 10 18:19:42 EDT 2002 | davef
Flex cracking under the terminations is generally regarded as one of the primary causes of failure of ceramic chips. If you can see cracks in the solder joints from board flex, those chips are certainly strongly suspect, and you must assume there is
Electronics Forum | Tue Sep 03 18:14:35 EDT 2002 | fmonette
I have never heard about a requirement for temperature ramp-up for baking components at 125C. In general the concern for delamination with moisture sensitive components starts above 200C (peak body temp). Most important is you should bake your com
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Wed Oct 09 19:15:16 EDT 2002 | russ
Dave, so for example I need to peak at 203 and hold for 5-10 sec. This is my normal profiling procedure with the exception that I usually try to hit about 215C along with staying above liquidous for 60 secs or so. Something I was curious about was
Electronics Forum | Fri Dec 27 14:21:11 EST 2002 | MA/NY DDave
Hi DaveF, Thanks a Good to Great approach. I would still recommend getting another one, just in case. I am never too sure about how anyone follows procedures and maybe the start up just won't go well for some reason and you don't want to piddle a
