Electronics Forum | Mon Mar 03 08:16:00 EST 2003 | martys
We are using MPM and DEK printers, what are the critical variables for measuring print process capability?
Electronics Forum | Mon Mar 03 09:16:09 EST 2003 | msivigny
Hello martys, The critical variables to measure print process capability on any printer are its ability to securely clamp a board, accurately align the board to its mating stencil, print with appropriate squeegee pressure and follow print material gu
Electronics Forum | Thu Jul 05 10:11:19 EDT 2007 | ck_the_flip
The variables to study: * Dwell Time * Contact Length * Conveyor Speed * Parallelism * Top-side Substrate Temperature Before wave * Solder Pot temperature All of these variables are inter-related (ie changing one variable will affect another)
Electronics Forum | Tue Jul 10 11:49:20 EDT 2007 | samir
Parallelism tends to drift: �h After preventative maintenance �h From dross buildup or other obstruction clogging either wave Parallelism should at least be studied during the process characterization stage, so that you know your machine's process
Electronics Forum | Thu Jul 05 21:46:53 EDT 2007 | davef
Here are the basics of determining that your process is in control and capable - http://lorien.ncl.ac.uk/ming/spc/spc9.htm There are tons of stuff like this on the web.
Electronics Forum | Thu Jul 17 20:20:12 EDT 2008 | davef
Wave set-up DOE * Immersion depth [1/3 to 2/3 of board thickness] has the least impact of any variable in wave soldering. * Contact length the greatest impact. * Control flux density, time through preheaters, top side temperature as the board reaches
Electronics Forum | Wed Nov 21 11:30:48 EST 2007 | cyber_wolf
Has anyone been involved in SMT placement equipment capability studies? I was wondering if anyone has procured used equipment and performed capability studies on the equipment and received quality and cost benefits from the resulting data. They
Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli
Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint
Electronics Forum | Mon Oct 15 10:53:21 EDT 2001 | Stefan
I would not mind some more business either. Although capable of installing all machine brands, I would like to restrict my expertise in the large vendor of German placement machines. stefwitt@netzero.net
Electronics Forum | Fri Apr 19 08:01:40 EDT 2002 | jnunns
We have been doing BGAs for about 3 years in house. We started off with an outside contractor and then brought it in. We are doing a variety of sizes from .05 to .03 pitch. We have 2D capability at print, but do not use it on any but the .03 pitch. T
