Electronics Forum: process (Page 1 of 1119)

Escalation process

Electronics Forum | Wed Oct 17 12:27:57 EDT 2001 | nifhail

Can anyone share with me the best timing for the escalation process, let it be either equipment downtime or process downtime ? Our SMT line is really up to the throat. I used to hv an escalation process like, say if the printer down, the machine will

Escalation process

Electronics Forum | Wed Oct 17 17:51:44 EDT 2001 | davef

This is a GREAT question!!!! Our process is similar, but our times are greater. Guess it's all dependant on the pressure on the pipe, eh? The faster money goes flying out the window, the less time there is for nicities.

BGA process

Electronics Forum | Tue Jul 15 09:02:38 EDT 2008 | ev

Thanks for your reply. Ev

BGA process

Electronics Forum | Thu Jul 17 12:19:51 EDT 2008 | realchunks

6 mil 100% on pad print. No shorts.

BGA process

Electronics Forum | Mon Jul 21 08:17:08 EDT 2008 | ev

Excellent feedback, thanks again.

no-clean process

Electronics Forum | Wed Sep 23 20:21:16 EDT 1998 | p. palshikar

i am working on a no-clean process implementation project in a company. i want to change a board to no-clean which had dendrite problems underneath the small resistors on the bottom side(in smt).i want more information on the exact cause of dendrites

Print-Glue-Wave process

Electronics Forum | Tue Mar 11 11:22:38 EST 2003 | slthomas

Is a water-soluble flux based paste an option for the bottom side? Then you could wash the residues from the board before wave. That's the only way we've tried that process. The difficulty we had was with some disturbed joints, apparently from s

no-clean process

Electronics Forum | Fri Mar 28 13:12:10 EST 2003 | barryg

We are going to be using a no-clean paste (smt)and no clean wave solder flux on a small pcb we will be doing here soon. As far as the wave process, should i purchase a new fluxer stone for the no-clean. Should I also purchse the recommended thinner o

no-clean process

Electronics Forum | Sat Mar 29 08:50:30 EST 2003 | davef

Barry Echoing an earlier poster, replace your stone. Use the suppliers' recommended thinner. Do NOT use isopropanol [IPA]. IPA contains water. Water is the bane of low residue soldering. It will get you in trouble fast. From IPC, get your hand

BGA process

Electronics Forum | Thu Jul 17 08:17:50 EDT 2008 | edmaya33

5 mil stencil.instead of round, use diamond aperture. RSS profile @ 215�C peak temp on balls(Sn/Pb), with a total of 3.5 minutes profile lenght.Ramp rate at 1.7�C/sec from ambient to 160�C. Consider also good cooling system on reflow. If rework proc

  1 2 3 4 5 6 7 8 9 10 Next

process searches for Companies, Equipment, Machines, Suppliers & Information