Electronics Forum | Wed Oct 06 09:23:47 EDT 1999 | Wolfgang Busko
| I would like comments on how the industry handles 0402 parts, regarding identification. Since the parts are too small to be labeled, how can we accurately identify the parts and or values, either before or after assembly? | When the boards go to te
Electronics Forum | Tue Oct 05 06:03:37 EDT 1999 | Graham Naisbitt
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Thu Sep 30 13:37:08 EDT 1999 | Dave F
| | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | What is the best way to
Electronics Forum | Fri Oct 01 04:03:31 EDT 1999 | Brian
| I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | What is the best way to achi
Electronics Forum | Mon Sep 27 15:25:43 EDT 1999 | Earl Moon
| I'm trying to start a small SMT contract shop and I need | assistance in selecting equipment. Quad seems to be the | leader but if there is something else out there that can | better suit me please let me know. My shop starting out | is going to b
Electronics Forum | Mon Sep 27 09:13:46 EDT 1999 | John O'Brien
| Writing the final report for my engineering studies (microsystem technology) I'm treating the identification of PCBs from automotive applications by laser marking with a data matrix code. | | | No I'm trying to set up a programme of how to test t
Electronics Forum | Sat Sep 25 09:00:44 EDT 1999 | John
| I am developing a DOE for evaluating SMT adhesives. I would like to evaluate 3 different vendor dispensing adhesives. I currently have the Heraeus PD955M and the Loctite 3609 and 3618 selected for evaluation. I would like to add another manuf
Electronics Forum | Thu Sep 23 11:30:58 EDT 1999 | Earl Moon
| | Hiya, | | | | Could anyone please suggest recommended manufacturers of | | IR rework stations for the removal of various SMT comps. | | | | Cheers | | | Hey Jack: Let's not get lost. The issue is money versus process control. How much do y
