Electronics Forum | Thu Mar 16 07:02:38 EST 2000 | Scott Davies
Does anybody have any experience or knowledge of processing PCB assemblies featuring pyroelectric sensor devices, the type used in Passive Infra-Red Sensor modules? Since these devices are, by definition, very sensitive to heat, how do you get round
Electronics Forum | Mon Mar 06 16:42:25 EST 2000 | Jon Wentz
Hi PR, FYI,some adhesives harden within the stencil apertures with IPA if not cleaned well. We used Heraeus PD955PY and had to closely inspect our cleaning process of the stencil. Just another tip, ask your adhesive vendor for their recommendation o
Electronics Forum | Fri Feb 25 10:23:46 EST 2000 | K3 Equipment
Greg, If you are having a problem, i would first check board manufacturers process. Also are they shipping boards to you in seal packages (a must if you are in a humid part of the country.) Most of the time with a few simple process controls moistur
Electronics Forum | Tue Jan 30 07:55:31 EST 2001 | ibi
I will have to process a PQFP 128 with a pitch of 0.4 mm. Given that the width of its leads are about 0.13-0.23 mm, i dread the worst when printing the solder paste. So, i would like to know if some people have yet test this type of fine pitch, what
Electronics Forum | Tue Mar 20 13:51:38 EST 2001 | mparker
Contact http://www.circuittechctr.com. They have a rework process and sell the necessary materials. You can buy the complete system, or just the gold solution and use your own power supply for the electrolysis. Be sure to completely evaluate and und
Electronics Forum | Tue Apr 24 04:34:31 EDT 2001 | Barry
Can anyone assist with names of publications for anyone requiring some basics on SMT production,process reliability issues etc etc. I have been out of the industry for approx 10 years and need a quick update in SMT with particular regard to process i
Electronics Forum | Tue Aug 22 10:58:20 EDT 2000 | Dr. Ning-Cheng Lee
I do not expect that we will see increased residue volumes, but they may be a bit more difficult to remove (in a cleaning process). A related issue is probe-testability. We can expect, at least initially, that there will be higher defect rates asso
Electronics Forum | Thu Jul 20 12:23:00 EDT 2000 | Dave F
Bob: Please help us understand the effect of changing to lead-free solder paste on our processes better. Compare the following for tin-lead and lead-free solders: * Size of stencil apertures � amount of solder necessary for a reliable solder conne
Electronics Forum | Thu Jul 20 14:31:20 EDT 2000 | Bob Willis
The process is not that difficult so have a go as soon as possible. Take a board wipe some paste on a board stick the part in and run it through the reflow process. Don�t worry about balling just see what you get first, that what I did first ! The m
Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
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