Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Fri Jan 21 16:50:33 EST 2005 | Board House
I work for a board house and our proceedure for this process is the following, We cover the via pads leaving the hole open and then apply the surface finish and then go back and Cover the Via with a second operation. By doing this you do not entrap
Electronics Forum | Tue Jan 04 13:01:25 EST 2005 | Brad
I have two questions that maybe someone can answer? 1. Can or should lead free components be used with standard 63/37 processes? including sn/pb pcb's? 2. Can or should sn/pb components be used for lead free process? I have recieved mixed feeling
Electronics Forum | Thu Jan 06 09:03:57 EST 2005 | russ
It appears that this particular PCB supplier has a non-optimum HASL process along with other issues. It is much harder to completely remove the solder out of vias on thicker boards. Looks like more air pressure was needed to remove all of the exces
Electronics Forum | Thu Jan 06 16:11:07 EST 2005 | Chunks
It appears your board house is having a problem with the solder resist (mask). From the couple pix it appear that the holes are being plugged by the mask, so your HASL is not able to be blown out during the hot knife process. Time to call your boar
Electronics Forum | Wed Jan 19 18:29:40 EST 2005 | russ
Anybody out there that can give me the basic details about Chip on board and the manufacturing process to place these parts onto assemblies? Any special equipment/processes required? We are a contract manufacturer and have been asked to implement. I
Electronics Forum | Fri Feb 18 17:57:46 EST 2005 | Grant
Hi, The normal electronic components you purchase should have lead free variants. Also, all solder paste manufacturers have lead free solder pastes, so you just need to get the paste specification, and then re-profile your oven for it. Temps are hig
Electronics Forum | Fri Feb 18 23:21:00 EST 2005 | JSS
Hi Everybody, Mostly customer asked about the solder paste height checking after printing process.Is it compulsory to check the height if we are using stainless steel stencil and metal blades in fully automatic printer.Any technical answer to their
Electronics Forum | Sat Feb 19 09:26:19 EST 2005 | davef
Your customer asks a reasonable question. How do you know that your: * Paste has not dried? * Stencil aperatures have not become clogged? * On and on ... Some agrue that printing is the most critical process and that it drives all down-stream failu
Electronics Forum | Fri Feb 25 18:13:17 EST 2005 | davef
Your leadfree dross should float, similar to your leaded dross. It's possible you're thinking about the process for removing excess copper from the solder pot. Following the same process, with: * Leaded solder, the copper floats. So, you scoop the