Electronics Forum: process (Page 21 of 1146)

BGA process requirements

Electronics Forum | Thu Apr 11 18:47:43 EDT 2002 | slthomas

A couple of questions to establish a baseline for when the check writers start asking questions........ How many of you have vision systems on site for BGA inspection? If you don't have it, do you do 100% X-ray, or did you just nail down the proces

Re: Cleaning process

Electronics Forum | Wed May 03 20:12:48 EDT 2000 | Dave F

Ernie: I'm guessing your question is a bit far a field for us. I�d guess that 70% of us are no-clean with the remainder focusing almost exclusively on cleaning printed circuit boards. So rather than limiting yourself with us, also consider forums a

seeking better process

Electronics Forum | Wed Mar 21 14:26:40 EST 2001 | jax

Ed, Although I will have to agree with Boca that building your own boards is probably the way you eventually want to go, that is not a reason to go out and buy whatever machines you can afford at this point in time. Have you thought of sub-contractin

SMT process consultants

Electronics Forum | Mon Sep 16 13:07:07 EDT 2002 | dragonslayr

JoJo- please keep your "mining" for leads to other forums; you have activated a nearly one year old thread that has no relevance today other than your interest in your making a contact. Try contacting the original poster direct. If you have somethin

BGA process requirements

Electronics Forum | Fri Apr 19 09:41:45 EDT 2002 | angiewest

We have been building BGA's for a couple of years. We even use a Universal Omni 4766 to place them with. Reflowing is where I thought we may have problems, Since we have an IR oven. But we bought a .010" thermocouple from Omega to measure the BGA

SMT process Blowhole/ Pinhole

Electronics Forum | Sat Mar 29 01:59:09 EST 2003 | iman

Yep, only the MLF have this blowhole/pinhole issue. Other components like SOT(transistor), CAP, RES are hey-o-kie. Btw, MLF = micro lead frame (IC/LGA) package. looks like a BGA without the solder balls. has direct attachment to the PCB ENIG pads wi

Flip Chip Underfil process

Electronics Forum | Thu Jun 26 08:49:21 EDT 2003 | caldon

Depends on your Material (Chemistry) and Machine. We use a hot plate with the material in an "L" patern. The Hot plate is used only in aiding the capillary action. Also, is time an issue?? Here is a good paper from Asymtek that was poster in Advan

CP642's vision process error

Electronics Forum | Mon Jul 28 19:41:30 EDT 2003 | ryan1v

Hi mantis, If you don't mind. Can you give me your e-mail address(the mail service on smtnet can't attach file)? I can mail you the picture that I took from the monitor by digital camera. Maybe you can through the picture to understand what I mean "i

CP642's vision process error

Electronics Forum | Wed Aug 06 14:52:15 EDT 2003 | cyber_wolf

Checking the vacuum at all stations is a good place to start. A vacuum guage with a piece of hose attached to a CP nozzle is a very handy tool to have. If you notice less vacuum at any one of the stations, you can start by looking @ the spool valves

Lead-Free qualification process

Electronics Forum | Mon Aug 22 09:27:20 EDT 2005 | javi

The list is not yet completed but I picked few different component that our supplier are not able to get in Lead-Free or problem to get leadtime: Mfg Part : Zener Diodes BZG03 - MFG : Phillips Mfg Part : PME271Y447M - MFG: Evox-Rifa Mfg Part : LMC606


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