Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
Electronics Forum | Mon Jun 18 18:37:53 EDT 2001 | davef
OK. We have a new board with a BGA on it. When have a nice new Glenbrook xray inspection machine. Our troops are trained. Specifically, what are the steps we should use to qualify our BGA soldering process and how should be best use our new Glenb
Electronics Forum | Mon Jun 18 19:32:58 EDT 2001 | Gil Zweig
I believe that at the present time the industry really does not know how to use x-ray inspection apart from indentifying the obvious defects such as shorts, missing balls and gross solder voids. The real utility of x-ray inspection is to recognize: 1
Electronics Forum | Tue Jun 26 09:37:28 EDT 2001 | Steve Vargas
We are interested in doing some further studies on our cleaning process, particularly with respect to how well we can clean underneath low profile components. As an SMT subcontractor, we'd ideally like to qualify our chemistry/cleaning process to cer
Electronics Forum | Thu Jul 12 10:45:42 EDT 2001 | Hussman
Since your customer is complaining, you'd better be pro-active. Doesn't mean they're right, but without customers, life sux alittle. Anyway, ask them for a profile of the 5 reflow processes. If they don't have that and you have a profiler, ask if
Electronics Forum | Mon Jul 16 08:56:56 EDT 2001 | Hussman
Easy, DL says the customer is telling him after 5 reflow processes they get solder under the mask. He tried it and didn't see anything. DL needs more information to understand why and where this is occurring. So, if he can't duplicate the problem
Electronics Forum | Thu Jul 12 13:37:18 EDT 2001 | markc
I can't comment on the quality of any vendors equipment, but your question is really a "process approach" issue. What do you expect to find with that 3rd dimensional measurement? 2D inspection should detect the majority of your printing errors.
Electronics Forum | Mon Aug 06 16:08:57 EDT 2001 | seand
Hello Again John, Are you injecting a like material currently? How are you doing this with your current process? Is this material being used specifically because the customer identified it as such? If this is not a current process for you, how do
Electronics Forum | Mon Aug 13 16:44:43 EDT 2001 | seand
Hello Hussman, Sorry about the misplacement of my strand on yours. I was just posting to the very end of the conversation at the time. My statements were not aimed at you or at sales in general. Just trying to show that not all of us in sales are
Electronics Forum | Tue Feb 01 09:53:58 EST 2000 | Ron Costa
I've been using the Electroless Nickel/Immersion Gold plating process for some time now. Here is what i know: It's very flat and solderable if you hold the board house to the following criteria: 120u inches of Nickel 4-9u inches of Gold What type of
