Electronics Forum | Fri Apr 04 18:16:43 EDT 2014 | garym4569
We are in the process of launching a new product and found reflow solder issue with one of the inductors. I have set oven profile to paste specifications. I just finished profiling with thermocouple under problem component. All other components ex
Electronics Forum | Thu May 08 19:52:40 EDT 2014 | hegemon
There are many different style LGA packages, but don't sweat it. Stick with the manufacturers recommendations for PWB pad geometry for a start. Voiding can be reduced by careful profiling, and also by pre-tinning the devices. QFN style packages can b
Electronics Forum | Fri May 09 14:40:38 EDT 2014 | hegemon
I might start with the equivalent 4 or 5 mil stencil and 1:1 on the apertures. If voids are too prevalent, then I would tin the pads of the device, remove the solder, and then solder as above. You may have another hurdle, in that the resulting stan
Electronics Forum | Tue May 13 17:53:54 EDT 2014 | anvil1021
Hello Michel...this might be a bit of a battle finding the low thermal EMF material that you are looking for. The first one that comes to my mind is Bismuth Selenium Telluride, with either a nickel or cobalt doping agent. Silver went away from this
Electronics Forum | Fri May 23 23:45:38 EDT 2014 | edriansyah
Hi Evtimov. 1. yes both part and the process are lead free/RoHS 2. I ever did X-ray, the balls shape are good and I dont see any evident of head in pillow (but my x-ray machine is not too good) Head in pillow was also my first suspect. but after the
Electronics Forum | Fri May 30 20:03:14 EDT 2014 | hegemon
Starting with the manufacturers layout is a good start. Tilted parts, bad solder joints, sounds like a wetting issue and the board or the parts. Insufficient solder sounds like the printing process needs some attention. We have used this part in th
Electronics Forum | Sun Jun 01 13:25:26 EDT 2014 | davef
Eurolanders and Asians are the primary users of immersion tin. In the US, the use of immersion tin is restricted due to the concern over the thiourea that used in tin plating process. Thiourea is a suspected carcinogen. I’m inclined to say, “aww, as
Electronics Forum | Wed Feb 25 11:37:01 EST 2015 | jasonnova
We have a customer with an assembly that will require potting using 3M DP-270. There is a component that needs to be covered with potting material but it is considerably higher than the overall potting height of the cavity. The low viscosity of the
Electronics Forum | Wed Mar 04 10:59:24 EST 2015 | jpierre
Hi first DS65 version is a specific dilution for dispensing machine, in this case the typical process is following: application of the conformal coating extraction of solvent (low extraction power is better)2minutes and drying the drying can be done
Electronics Forum | Wed Mar 04 11:20:19 EST 2015 | jorge_quijano
Hola, I'm about to evaluate our BGA capabilities by using a dummy PCB+Components kit, I'll be evaluating solder paste, pick n place, reflow process & rework method. I have an idea of how to validate these processes. I'm planning to send different sa
