Electronics Forum | Thu Aug 03 12:02:50 EDT 2000 | James
Does anyone out there use a semi-automatic clamshell printer in production with pitches down to 20 mil? I would appreciate any advice you have on process control and setup parameters for this type of printer. James
Electronics Forum | Thu Aug 03 10:53:23 EDT 2000 | Roni Haviv
Hello, Does enyone have any experience with Immersion Tin (Sn) as a finish process on PCB ? Any information will help ! Thanks Roni
Electronics Forum | Mon Jul 10 15:43:49 EDT 2000 | JAX
Mark, As far as what is the correct way; No Harm, No Foul! Adhesive bonding is more susceptible to damage caused in transportation of product; even from one side of the building to the other. This is why it is general practice to run it last��Smaller
Electronics Forum | Tue Jul 11 11:30:34 EDT 2000 | genglish
Dave, the material in question is Acetal. I believe it is anti static. Should there be any charge built up then (hopefully) the charge is dissipated through the frame in which it is housed within the printer. It is an established process within our c
Electronics Forum | Tue Jun 27 09:12:15 EDT 2000 | james liang
hello all, DSS Model of cordless phone base unit during process TOP - REFLOW- FCT - BOTTOM - REFLOW - Wave solder and then the IC101 leg of RF unit lifted..?
Electronics Forum | Tue Jun 20 22:52:46 EDT 2000 | gary
How to calculate the delta T ? What's the allowable range for delta T value? we r not calculating this in our process, instead we r maintaining the pre-heat temp which we measure from topside of the bd. Thanks in advance
Electronics Forum | Mon Jun 19 08:23:23 EDT 2000 | JAX
Jacqueline, The following link will take you to a process related bga site.You might want to check out this bga design website also. www.analog.com/industry/dsp/bga/bgadesig.html Have fun, JAX
Electronics Forum | Fri Jun 23 10:09:38 EDT 2000 | Bob Willis
There is a CD ROM which I updated this year on BGA process and defect guide see the SMTNET bookshop or call the SMTA for the Interactive CD ROM which has a defect gallery. Bob Willis
Electronics Forum | Tue Jun 13 22:42:36 EDT 2000 | Dave F
Jeff: Last place I can recall seeing something like that is NASA-STD-8739.3 Requirements like this are not currently in vogue. A modern solder process should conform to J-STD-001, which makes no mention of prebaking boards.
Electronics Forum | Fri Jun 09 14:00:08 EDT 2000 | khalid
I am not aware if there is any standard but INTEL web site has some really good step by step process for reworking BGA's. Khalid Saeed