Electronics Forum: process (Page 296 of 1146)

ESD suitability of bare wood

Electronics Forum | Mon Feb 11 21:57:03 EST 2002 | davef

Cal: What's a "sniffer"? No-Cleaners: * How do clean your board handling racks / carriers? * How do determine the level of residues on your boards? How often do you do that process?

What is the acceptable Halide content of

Electronics Forum | Mon Feb 25 21:14:25 EST 2002 | davef

This sounds like information bantied-about by the fine folk at CSL [Contamination Studies Laboratories in Kokomo, IN]. If so, this includes the sum of the halides from the following sources: * Fabricated board * Components * Processing of the assemb

Solder Paste Inspection System.

Electronics Forum | Thu Feb 28 11:37:28 EST 2002 | Nightbull

I would like to know if there are any IPC standards or anything remotely referring to having a Solder Paste Deposition tester in house to check the printing process. I have an interesting situation. Any help would be appreciated.

BGA In Circuit Testing

Electronics Forum | Wed Mar 06 10:24:32 EST 2002 | Charlie

Here our senerio: * There are no funds for additional test equipment. * Have only Delta Scan results, that are very limited. * Failuer of Delta Scan, PCB goes to vendor for X-ray analysis. Do you have a similar process and do you do anything diffe

Wave Soldering with or w/o Nitrogen

Electronics Forum | Tue Mar 12 22:27:50 EST 2002 | davef

I'd speculate that the properties of a well formed solder connection processed in air and N2 are indistinguishable. Then again, the pitch is that N2 gives a wider process window, especially for NC flux-types. In the SMTnet Library look for: �Opti

Adhesive Printing

Electronics Forum | Tue Mar 12 14:26:51 EST 2002 | cbarnett

Currently I am dispensing adhesive and would like to screen adhesive. Just need to know if anyone has had any luck with this process. If so what adhesive are you using and what are your printer parameters?

reduce solder ball defect

Electronics Forum | Sat Mar 16 11:06:48 EST 2002 | Lau

Hi, I am searching a method of reflow process for less / nothing solder ball defect. Thank Lau

Cpk Variables Control for Paste Printing

Electronics Forum | Tue Mar 19 11:54:08 EST 2002 | davef

FORMULA OTHER THAN LxBxZ? - Paste is X% [X=~50] metal by volume. Your paste supplier knows the value of 'X'. HOW TO ACHIEVE A CONSTANT REFLOW PROCESS CAPABILITY? - Buy a capable oven, operate and calibrate it properly.

Cpk Variables Control for Paste Printing

Electronics Forum | Wed Apr 03 18:31:54 EST 2002 | davef

To date, much of this discussion has focused on determining the volume of solder paste. That is but one piece of the measurement of process capability. The other aspect that needs to be evaluated is: an assessment of the accuracy of the positioning

Cpk Variables Control for Paste Printing

Electronics Forum | Thu Apr 04 09:22:35 EST 2002 | itempea

What are the normal control limits in the industry, for a well controlled process, using a 6 mils stencil? Should they be different according to the surface finish (higher UCL for ENIG, Im SN, etc, lower UCL for HASL)? Thanks, Ioan


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